Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Keiichiro Masuko

Masato Shigematsu

Naoki Yoshimura

Daisuke Fujishima

Yasufumi Tsunomura

Izuru Nakai

Takahiro Mishima

Naofumi Hayashi

Hirotaka Katayama

Wataru Shinohara

Daiji Kanematsu

A solar cell () includes a semiconductor substrate () having a light-receiving surface () and a back surface (); an n-type semiconductor layer () and a p-type semiconductor layer () provided on the back surface () of the semiconductor substrate (), the n-type semiconductor layer () and the p-type semiconductor layer () extending in a first direction and being adjacent to each other in a second direction intersecting with the first direction; and a ground layer () provided on the n-type semiconductor layer () and the p-type semiconductor layer (). The ground layer () includes an n-side ground layer () and a p-side ground layer () separated from each other by a first separating groove () having a first separating portion () and a second separating portion () as well as a first bridge portion () separating the first separating portion () and the second separating portion (). The first bridge portion () separates the first separating portion () and the second separating portion () at at least one of a border on the n-side ground layer () or a border on the p-side ground layer () in the first direction.

Solar cell, and method for manufacturing solar cell

Solar battery module

A solar cell is equipped with: a wafer; an n-type laminated body that is provided on the first main surface side of the wafer; and a p-type laminated body, which is provided on the first main surface side of the wafer such that the p-type laminated body is adjacent to the n-type laminated body in the X direction, and which extends in the Y direction. The wafer has: a lightly doped region that is doped to be n type; and a plurality of first main surface-side highly doped regions, which have an n-type dopant concentration that is higher than that of the lightly doped region, and which are provided between the lightly doped region and the p-type laminated body. The first main surface-side highly doped regions are discretely provided at intervals in the Y direction.

Solar cell

A solar cell is provided that comprising a semiconductor substrate having a first conductivity type; a first semiconductor layer having the first conductivity type, and on a principal surface of the semiconductor substrate; an insulation layer on the first semiconductor layer; a protective layer on the insulation layer; and a second semiconductor layer having a second conductivity type, and on the semiconductor substrate and the protective layer. A recessed region is positioned at a lateral side of the insulation layer, the recessed region formed by recessing a side surface of the insulation layer inward from a side surface of the first semiconductor layer and a side surface of the protective layer, and the second semiconductor layer is positioned in the recessed region above the first semiconductor layer in the recessed region.

Method of manufacturing solar cell and solar cell

A method of manufacturing a solar cell includes: providing an insulating layer on a semiconductor layer provided on at least a part of a principle surface of a semiconductor substrate; providing a mask layer on the insulating layer; removing a part of the mask layer by laser irradiation so as to form a first opening through which the insulating layer is exposed; and removing, by an etching agent, the insulating layer exposed through the first opening so as to form a second opening through which the semiconductor layer is exposed.

Method of manufacturing solar cell

A method of manufacturing a solar cell includes: forming a conductive thin film layer on a semiconductor substrate; forming an insulating film on the conductive thin film layer; forming a conductive thin film layer exposed portion by removing a part of the insulating film; forming a plating film in the conductive thin film layer exposed portion; and removing the insulating film and the conductive thin film layer in an area not overlapping the plating film, wherein the plating film formed in the forming of a plating film is formed to cover the insulating film.

Method of manufacturing back surface junction type solar cell

A method of forming an electrode pattern includes: forming, on a base material, a seed layer having a pattern corresponding to the electrode pattern; forming an organic material layer on the seed layer; producing an electrode layer transfer sheet by forming an electrode layer on the organic material layer via an electroplating process using the seed layer as a seed; disposing the electrode layer transfer sheet on a substrate on which the electrode pattern is to be formed such that the electrode layer is in contact with the substrate and pressure bonding the electrode layer to the substrate; and in a state in which the electrode layer is pressure bonded to the substrate, removing the base material along with the organic material layer and the seed layer to transfer the electrode layer to the substrate.

Growing community of inventors

Osaka, Japan

Keiichiro Masuko