Seiko Instruments Inc

Sii Semiconductor Corporation

Toray Advanced Film Co., Ltd.

Maruwa Corporation

Keiichiro Hayashi

Hiroyuki Fujita

Sadao Oku

Koji Tsukagoshi

Hitoshi Kamamori

Tsutomu Matsuhira

Masaru Akino

Hideaki Adachi

Nobukazu Koizumi

Tadahiro Nishigawa

Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member () including a hollow portion () having an inner bottom surface on which a semiconductor chip () is mounted, a surrounding portion () that surrounds the hollow portion (), and a bottom surface portion (); an inner lead (); and an outer lead () exposed from the resin molded member (). The inner lead buried in the molded member () includes an L-shaped lead extending portion having a through hole formed therethrough.

Semiconductor device

Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Optical semiconductor device

An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.

Optical sensor device

A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.

Optical sensor device having wiring pattern within cavity housing optical sensor element

Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (), a glass substrate () with a cavity having divided and exposed through-hole electrodes () on the periphery thereof, and an optical sensor element () mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Optical sensor device and method of manufacturing the same

A lighting device has a glass substrate and a lead frame embedded in the glass substrate. The glass substrate has a front surface, a side surface and a rear surface, the front surface having a recess portion with a bottom surface. The lead frame has a portion exposed on the side surface of the glass substrate and a portion exposed on the bottom surface of the recess portion. A line width of a region of the portion of the lead frame exposed on the bottom surface of the recess portion is narrower than a line width of a region of the portion of the lead frame exposed on the side surface of the glass substrate. A light emitting element is mounted in the recess portion of the glass substrate and is electrically connected with the portion of the lead frame exposed on the bottom surface of the recess portion. A sealing material covers the light emitting element.

Lighting device having light emitting element mounted in glass substrate

In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80&#xb0; C. to 100&#xb0; C. Thereafter, an IC is mounted on the film substrate.

Growing community of inventors

Chiba, Japan

Keiichiro Hayashi