Ngk Insulators, Inc.

Ngk Isulators, Ltd.

Keiichiro Asai

Tomohiko Shibata

Mitsuhiro Tanaka

Jungo Kondo

Shoichiro Yamaguchi

Tomoyoshi Tai

Naotake Okada

Shigeaki Sumiya

Yudai Uno

Yukinori Nakamura

Tetsuya Ejiri

Masahiko Namerikawa

Masashi Goto

Takashi Yoshino

Yuji Hori

Yuichi Iwata

Ryosuke Hattori

Osamu Oda

Shuhei Higashihara

Kentaro Tani

Teruyo Nagai

Iwao Ohwada

Toshihiro Tomita

Takahiro Yamadera

Akira Hamajima

Kousuke Niwa

Naoki Fujita

Jungo Kondou

Hiroshi Matsunaga

Minori Tani

Masato Niwa

Hiroyoshi Ina

Takeshi Yamamoto

Mitsuhiro 703 Arthills-Kirigaoka Minamikan Tanaka

Provided is an optical scanning element, which has a large scan angle, is quickly responsive, and can be downsized. The optical scanning element includes: a photonic crystal layer having holes periodically formed in an electro-optical crystal substrate; a line-defect optical waveguide formed in the photonic crystal layer; a diffraction grating arranged in at least one portion selected from an upper portion, a left side surface portion, and a right side surface portion of the optical waveguide; and electrodes arranged on a left side and a right side of the optical waveguide. The optical scanning element is configured so that an emission angle of light emitted from an upper surface of the optical waveguide is changed.

Optical scanning element

A waveguide device includes: a photonic crystal layer having holes periodically formed in an electro-optical crystal substrate; a line-defect optical waveguide formed in the photonic crystal layer; a first electrode arranged above the electro-optical crystal substrate, the first electrode being transparent to light; and a second electrode arranged below the electro-optical crystal substrate. Each of an optical scanning device and an optical modulation device includes the above-mentioned waveguide device.

Waveguide device, optical scanning device and optical modulation device

There is provided a composite substrate in which peeling is significantly suppressed, light propagation loss is small when used as an electro-optical element, and high-speed and low-voltage drive is possible, and which can achieve an extremely thin electro-optical element capable of maintaining excellent reliability even under a severe high-temperature environment. A composite substrate for an electro-optical element according to an embodiment of the present invention includes: an electro-optical crystal substrate having an electro-optical effect; a first high dielectric layer; a second high dielectric layer; and a support substrate in the stated order. The first high dielectric layer and the second high dielectric layer are directly joined to each other, and an amorphous layer is formed at a joining interface between the first high dielectric layer and the second high dielectric layer.

Composite substrate for electro-optical element

A composite substrate includes: a piezoelectric layer; and a reflective layer arranged on a rear surface side of the piezoelectric layer, wherein the reflective layer includes a high-impedance layer and a low-impedance layer containing silicon oxide, and wherein a ratio of a region of first structures in the high-impedance layer is more than 70%.

Composite substrate and surface acoustic wave element

A bonded body includes a supporting substrate, piezoelectric material substrate and a multilayer film between the supporting substrate and piezoelectric material substrate. The multilayer film includes a lamination structure having a first layer, second layer, third layer and fourth layer in that order. The first layer and third layer are composed of silicon oxides, and the second layer and fourth layer are composed of metal oxides. The refractive index of the second layer is higher than the refractive index of the first layer and refractive index of the third layer. The refractive index of the second layer is different from the refractive index of the fourth layer.

Bonded body and acoustic wave element

A phosphor element includes a phosphor part including an incident face of the excitation light, opposing face opposing the incident face, and side face, the phosphor part converting at least a part of the excitation light incident onto the incident face to fluorescence and emitting the fluorescence from the opposing face or incident face, and a heat dissipating substrate provided on the side face of the phosphor part. The heat dissipating substrate is composed of a metal plating film composed of a metal having a thermal conductivity of 200 W/mK or higher.

Phosphor element with heat dissipating substrate that has thermally conductive metal plating film

A phosphor element includes: a phosphor part having an incident face for excitation light, an opposing face opposing the incident face, and a side face, the phosphor part converting at least a part of the excitation light incident onto the incident face into a fluorescence and emitting the fluorescence from the incident face; an integral low refractive index layer on the side face and opposing face of the phosphor part and having a refractive index lower than that of the phosphor part; and an integral reflection film covering a surface of the low refractive index layer. The area of the incident face of the phosphor part is larger than the area of the opposing face.

Phosphor element and lighting device

An acoustic wave device includes a piezoelectric material substrate, an intermediate layer on the piezoelectric material substrate and composed of one or more materials selected from the group consisting of silicon oxide, aluminum nitride and sialon. A bonding layer is on the intermediate layer and is composed of one or more materials selected from the group consisting of tantalum pentoxide, niobium pentoxide, titanium oxide, mullite, alumina, and a high resistance silicon and hafnium oxide. A supporting body is composed of a polycrystalline ceramic and is bonded to the bonding layer by direct bonding, and an electrode is on the piezoelectric material substrate.

Acoustic wave devices and a method of producing the same

A vibrating plate-bonded body includes a supporting substrate composed of silicon, a vibrating plate composed of a highly rigid ceramics and having a thickness of 100 &#x3bc;m or smaller, and a bonding layer between the supporting substrate and vibrating plate, contacting a bonding surface of the vibrating plate and composed of &#x3b1;-Si. The arithmetic average roughness Ra of the bonding surface of the vibrating plate is 0.01 nm or more and 10.0 nm or less, and the pit density of the bonding surface of the vibrating plate is 10 counts or more per 100 &#x3bc;m.

Vibrating plate-bonded-body

A piezoelectric monocrystalline substrate is composed of a material represented by LiAO(A represents at least one element selected from the group consisting of niobium and tantalum), a bonding layer is compose of a material of an oxide of at least one element selected from the group consisting of niobium and tantalum, and an interface layer is provided along an interface between the piezoelectric monocrystalline substrate 6 and bonding layer, and the interface layer has a composition of EO(E represents at least one element selected from the group consisting of niobium and tantalum and 0.29&#x2264;x&#x2264;0.89).

Bonded body with piezoelectric monocrystalline substrate and supporting substrate

An optical scanning device includes a supporting body; an optical waveguide composed of a single crystal having electro-optic effect and integrated with the supporting body directly or through a clad layer; a plurality of periodic domain inversion parts formed in the optical waveguide, the periodic domain inversion parts having periods different from each other; and a plurality of electrodes capable of applying voltages on the periodic domain inversion parts, respectively, to generate diffraction gratings in the periodic domain inversion parts, respectively. The clad layer is composed of a material having a refractive index lower than a refractive index of the single crystal forming the optical waveguide. Each of the periodic domain inversion parts on which the voltage is applied is selected to generate the diffraction grating in the selected periodic domain inversion part so that a propagation light propagated in the optical waveguide is emitted to the outside of the optical scanning device as a diffracted light.

Phosphor element, method for producing same, and lighting device

A phosphor device includes a phosphor layer composed of a phosphor glass or phosphor single crystal, a reflective film provided on the phosphor layer, a warping suppression layer provided on the reflective film, and a supporting body bonded to the warping suppression layer by direct bonding. An excitation light incident into the phosphor layer is converted to fluorescence, and the fluorescence and excitation light are reflected by the reflective film and emitted from the phosphor layer.

A bonding layeris formed over a piezoelectric material substrate, and the bonding layer is made of one or more materials selected from the group consisting of silicon nitride, aluminum nitride, alumina, tantalum pentoxide, mullite, niobium pentoxide and titanium oxide. A neutralized beam is irradiated onto a surface of the bonding layer and a surface of a supporting body to activate the surface of the bonding layer and the surface of the supporting body. The surface of the bonding layer and the surface of the supporting body are bonded by direct bonding.

Bonding method

A phosphor element comprises: a support substrate; an optical waveguide for propagating an excitation light through the waveguide, the optical waveguide comprising a phosphor generating a fluorescence, and the optical waveguide comprising an emission side end surface emitting the excitation light and the fluorescence, an opposing end surface opposing the emission side end surface, a bottom surface, a top surface opposing the bottom surface and a pair of side surfaces; a bottom surface side clad layer covering the bottom surface of the optical waveguide; a top surface side clad layer covering the top surface of the optical waveguide; side surface side clad layers covering the side surfaces of the optical waveguide, respectively; a top surface side reflection film covering the top surface side clad layer; side surface side reflection films covering the side surface side clad layers, respectively; and a bottom surface side reflection film provided between the support substrate and the bottom surface side clad layer.

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Nagoya, Japan

Keiichiro Asai