Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Kyowa Hakko Kogyo Co., Ltd.

Jumo, Inc.

Ricoh Company, Ltd.

Other

Microsoft Technology Licensing, LLC

Nintendo Co., Ltd.

Sumitomo Metal Industries, Inc.

Kyowa Hakko Kirin Co., Limited

Kabushiki Kaishi Toshiba

Sumitomo Metal Ceramics Inc.

Keiichi Yano

Masato Suzuki

Hiromasa Kato

Takayuki Naba

Motoo Yamasaki

Hironori Asai

Junji Yamabe

Kazuo Yamaguchi

Yuzuru Matsuda

Shigeto Kitamura

Hideki Kimura

Akira Nakamura

Seiji Terazawa

Seiji Sugimoto

Isao Kawamoto

Hideharu Anazawa

Eiji Tsukuda

Toshiyuki Suzawa

Shigeru Chiba

Takeo Tanaka

Koji Yamakawa

Kaoru Koiwa

Hiroshi Sano

Masayoshi Suzuki

Kenji Shibata

Mayumi Yoshida

Hideki Zemba

Michiharu Suzuki

Mitsuyoshi Endo

Kazuo Kimura

Kiyoshi Iyogi

Ryoichi Teranishi

Yoshitoshi Sato

Hideki Sato

Takashi Ono

Shinya Saito

Takashi Takahashi

Hideo Ichikawa

Nobuyuki Mizunoya

Yoshiharu Yokoo

Nobuo Iwase

Masashi Hasegawa

Toshihide Tomotaka

Tadashi Nagashima

Yoko Kato

Tatsuhiro Ogawa

Yoshikazu Morishita

Toshihide Ikemura

Tadanori Yamamura

Satoshi Kuroyanagi

Chieko Bando

Mika Makino

Yuuta Tanaka

Yoshinobu Konno

Tatsuya Ogawa

Naohisa Akashi

Hiroshi Takasugi

Takahiro Ikuma

Yukio Hashimoto

Makoto Yagasaki

Sadao Teshiba

Yusuke Uchida

Kimiya Miyashita

Yoko Arai

Shuichi Ishino

Jun Monma

Masaru Hasegawa

Miho Nakamura

Hiroshi Takamichi

Masaki Azuma

Tatsushi Umayahara

Kaori Ozeki

Daisuke Kubo

Teruo Shibata

Eiichi Masushio

Shizuki Hashimoto

Keiji Tanaka

Takahiro Moriyama

Masahiko Mashimo

Tadashi Ishii

Seiko Nagano

Kazuhisa Iwata

Kouji Yamakawa

Masafumi Fujii

Toshishige Yamamoto

Jun-ichi Kudo

Hirohisa Osoguchi

Masaaki Ando

Chris Esaki

Norihide Okada

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

Ceramic circuit board and semiconductor device using same

According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mmand includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

Ceramic metal circuit board and semiconductor device using the same

A ceramic circuit board comprises: a ceramic substrate with a 1.0 mm thickness or less including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate joined to the first area; and a second metal plate joined to the second surface. The second area has a first waviness profile along a first side of the first surface, the first waviness profile having one extreme value or less. The second area has a second waviness profile along a second side of the first surface, the second waviness profile has not less than two nor more than three extreme values.

Ceramic circuit board and semiconductor module

An object of this disclosure is to reduce differences in the drawn amount of the parison around the mouth of the toner container, thereby reducing the amount of resin for the toner container and the weight thereof. A powder container includes a cylindrical container body to rotate in a horizontal posture, a cylindrical mouth at a first end of the container body, smaller in diameter than the container body, a conveyor to convey the powder inside the container body toward the mouth, a scooping portion deeper in the container body than the mouth, to lift the powder above a powder inlet of a conveying tube inserted from the mouth and drop the powder to the powder inlet, and a radially inner face continuous with an inner end of the scooping portion, extending in a direction crossing the scooping portion and disposed inward in the radial direction than an outermost face of the container body. The radially inner face extends from the mouth toward a second end of the container body and is not inner in the radial direction than an inner rim of the mouth.

Powder container and image forming apparatus incorporating same

A nozzle receiver is to be arranged in a powder container used in an image forming apparatus. The nozzle receiver includes a nozzle receiving opening, in which a conveying nozzle for conveying powder supplied from the powder container is inserted in the image forming apparatus; an opening/closing member to open and to close the nozzle receiving opening; and a supporter to support the opening/closing member. The opening/closing member includes a sealing portion to seal the nozzle insertion opening. The supporter includes an end surface portion perpendicular to a moving direction of the opening/closing member. The projection area of the end surface portion in the moving direction of the opening/closing member is smaller than a projection area of the sealing portion in the moving direction of the opening/closing member.

Nozzle receiver, powder container, and image forming apparatus

According to an embodiment, when a nozzle insertion member is detached from a powder container, an engaging portion and an engaged portion are disengaged from each other by resiliently displacing the engaging portion in a direction in which the engaging portion is disengaged from the engaged portion. Therefore, it is possible to reduce a stress applied to the powder container and the nozzle insertion member at the time of attachment and detachment of the nozzle insertion member. Consequently, it becomes possible to easily detach the nozzle insertion member from the powder container.

Powder container, image forming apparatus, and nozzle receiver

In certain implementations, a presentation of a virtual counterpart of an action figure may be provided based on action figure state information obtained via wireless communication with the action figure. As an example, an action figure may be detected within a short wireless communication range of a computer system. A wireless connection between the computer system and the action figure may be established based on the detection. Action figure state information identifying a position of a moveable part of the action figure relative to another part of the action figure may be received at the computer system from the action figure via the wireless connection. The relative position may be related to a pose exhibited by the action figure. A virtual counterpart of the action figure may be presented based on the relative position such that the virtual counterpart exhibits the same pose as the action figure.

System and method for presenting a virtual counterpart of an action figure based on action figure state information

In certain implementations, state information of an action figure may be provided via wireless communication. As an example, a device may be detected within a short wireless communication range of an action figure. A wireless connection between the action figure and the device may be established based on the detection. Sensor information may be obtained via one or more sensors of the action figure. Action figure state information identifying a position of a moveable part of the action figure relative to another part of the action figure may be generated based on the sensor information. The relative position may be related to a pose exhibited by the action figure. The state information may be provided to the device via the wireless connection. A virtual counterpart of the action figure may be presented based on the relative position such that the virtual counterpart exhibits the same pose as the action figure.

System and method for providing state information of an action figure

In certain implementations, secured communication with an action figure or action figure accessory may be provided. As an example, a device may be detected within a short wireless communication range of the action figure or action figure accessory. A wireless connection may be established between the action figure or action figure accessory and the device based on the detection. A first key may be obtained. First encrypted information may be received from the device via the wireless connection, and processed based on the first key to determine a second key. An identifier associated with the action figure or action figure accessory may be obtained. Second encrypted information may be generated based on the second key and the identifier, and provided to the device via the wireless connection. The second encrypted information may be used to obtain a virtual counterpart of the action figure or action figure accessory.

System and method for providing secured wireless communication with an action figure or action figure accessory

In certain implementations, a software development kit to enable configuration of virtual counterparts of action figures or action figure accessories may be provided. As an example, the software development kit may enable a developer to associate a state or behavior of an action figure type with a virtual state or behavior of a corresponding virtual counterpart type in a virtual environment such that, when an action figure (of that type) exhibits the state or behavior, a corresponding virtual counterpart is caused to exhibit the virtual state or behavior in the virtual environment. The software development kit may, for example, enable the same state or behavior to be associated with different action figure types and/or different virtual states or behaviors such that, even when action figures of different action figure types exhibit the same state or behavior, their corresponding virtual counterparts may be caused to exhibit different virtual states or behaviors.

System and method for providing a software development kit to enable configuration of virtual counterparts of action figures or action figure accessories

A ceramic/copper circuit board of an embodiment includes a ceramic substrate and first and second copper plates bonded to surfaces of the ceramic substrate via bonding layers containing active metal elements. In cross sections of end portions of the first and second copper plates, a ratio (C/D) of an area C in relation to an area D is from 0.2 to 0.6. The area C is a cross section area of a portion protruded toward an outer side direction of the copper plate from a line AB, and the area D is a cross section area of a portion corresponding to a right-angled triangle whose hypotenuse is the line AB. R-shape sections are provided at edges of upper surfaces of the first and second copper plates, and lengths F of the R-shape sections are 100 &#x3bc;m or less.

Ceramic/copper circuit board and semiconductor device

In certain implementations, user performance related to a virtual environment may be utilized to provide a targeted presentation of action &#x2014;figures, action figure accessories, or other items (e.g., services, products, etc.) available for purchase in an online marketplace. As an example, performance indicator information related to performance of a user of the virtual environment may be obtained. One or more of the action figures or action figure accessories may be selected based on the performance indicator information. The selected action figures or action figure accessories may be presented to the user in the online marketplace.

System and method for providing an enhanced marketing, sale, or order fulfillment experience related to action figures or action figure accessories having corresponding virtual counterparts

Growing community of inventors

Tokyo, Japan

Keiichi Yano