Intel Corporation

Keiichi Tsujimoto

Suresh V Golwalkar

Richard B Foehringer

Michael Wentling

Ryo Takatsuki

Shigeo Kawashima

Nobuaki Sato

A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Dual sided integrated circuit chip package with offset wire bonds and

Manufacturing dual sided wire bonded integrated circuit chip packages

Growing community of inventors

Kitakyusyu, Japan

Keiichi Tsujimoto