Nissei Plastic Industrial Co., Ltd.

Seiko Instruments Inc

Keiichi Tozawa

Hozumi Yoda

Atsushi Murata

Hiroo Okubo

Satoshi Hoshino

Toshimi Kato

Yuichi Sakurada

A mold clamping device includes a base, a stationary platen fixed to the base and supporting a stationary mold, a movable platen movable on the base and supporting a movable mold, and a mold clamping mechanism for clamping the movable mold against the stationary mold. Tie bars extend from the stationary platen completely through both the movable platen and the mold clamping mechanism. A shaft supporting plate is fixed to the base and has openings through which the tie bars slidably extend for supporting the tie bars. The shaft supporting plate terminates at its lower end portion in two spaced-apart shoes that are fixed to the base. The bottom surface of each shoe has a larger area than the cross-sectional area of the shaft supporting plate situated vertically above the shoe.

Mold clamping device

A mold clamping device includes a base, a stationary platen fixed to the base and supporting a stationary mold, a movable platen movable on the base and supporting a movable mold, and a mold clamping mechanism for clamping the movable mold against the stationary mold. Tie bars extend from the stationary platen completely through both the movable platen and the mold clamping mechanism. A shaft supporting plate is fixed to the ends of the tie bars and terminates at its lower end portion in two spaced-apart shoes that have flat bottom surfaces in direct sliding contact with the base. The flat bottom surface of each shoe has a larger area than the cross-sectional area of the shaft supporting plate situated vertically above the shoe.

When a plurality of sets of molds, spaced a predetermined distance along a circumferential direction of a rotary platen, are attached through predetermined clamp portions to a mold attachment surface of the rotary platen supported by a movable platen included in a mold clamping device and a mold attachment surface of a fixed platen opposite this mold attachment surface, at least a mold clamping force, when the mold is attached, is previously limited to a limited mold clamping force lower than a mold clamping force at the time of molding. A mold attaching mode is set that has an interlock function of preventing the limitation from being cancelled until a condition under which all the clamp portions are turned on is satisfied. The selected mold attaching mode is performed when the molds are attached and the plurality of sets of molds are sequentially attached set by set.

Mold attaching method to mold clamping device

When a heating device is formed which includes at least one or more heatersandthat are provided on the outer circumferential surfacesandof at least one of a heating cylinderand an injection nozzleto heat at least one of the heating cylinderand the injection nozzle, at least some heaters, . . . of all the heaters, . . . are formed with air cooling-capable heatersandin which a panel memberformed of a material R having thermal conductivity is interposed between the heaters, . . . and the outer circumferential surfacesandof at least one of the heating cylinderand the injection nozzle, in which an air pathfor air cooling is formed in the panel memberand in which an air outlet and inlet portionallowing air A to be passed from an air supply portionis provided in the air path

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Nagano-ken, Japan

Keiichi Tozawa