Shinko Electric Industries Co., Ltd.

Keiichi Takemoto

Yoichi Harayama

Yoji Asahi

Hiroyuki Asakawa

Yasuyoshi Horikawa

Takahiro Rokugawa

Shuzo Aoki

Tatsuya Nakamura

Nobuyuki Iijima

Ken Sato

Takashi Onuma

Yusuke Muramatsu

An electrostatic chuck includes: a base body having: a mounting face on which an object to be adsorbed is to be mounted; and a back face that is opposite to the mounting face; an insulating layer that is formed on the back face; a heating element that is built in the insulating layer and configured to generate heat; and at least one thermal diffusion layer that is built in the base body and configured to diffuse the heat generated by the heating element. The at least one thermal diffusion layer is formed of a material higher in thermal conductivity than the base body.

Electrostatic chuck and substrate fixing device

A base plate has one surface and the other surface opposite to the one surface. An electrostatic chuck is capable of being mounted on the one surface. The base plate includes a refrigerant flow path provided therein. An inner wall of the refrigerant flow path has an upper surface convex toward the one surface in a longitudinal sectional view in a direction intersecting with a direction in which refrigerant flows. An unevenness is formed on the upper surface.

Base plate and substrate fixing device

An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.

There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.

Substrate fixing device, electrostatic chuck, and method of manufacturing electrostatic chuck

A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.

Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method

A substrate fixing device includes a baseplate, an insulating layer over the baseplate, and an electrostatic chuck on the insulating layer. The insulating layer includes a heating element and a metal layer. The metal layer has a higher thermal conductivity than the insulating layer and is positioned closer to the electrostatic chuck than the heating element.

Substrate fixing device

A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.

A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.

Substrate holding apparatus

A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

Growing community of inventors

Nagano, Japan

Keiichi Takemoto