Rohm Co., Ltd.

Keiichi Takahashi

Koshun Saito

A semiconductor device includes a semiconductor element, a packaging material that encapsulates the semiconductor element, and a metal member electrically connected to the semiconductor element and having a protruding portion protruding from an end face of the packaging material, in which the protruding portion has a lateral peripheral edge along the end face of the packaging material, a longitudinal peripheral edge along the normal direction of the end face, and a corner peripheral edge formed by side portions that are disposed at the corners of the protruding portion and continue to the lateral peripheral edge and the longitudinal peripheral edge, and in which the corner peripheral edge includes a first side portion intersecting substantially orthogonally with the lateral peripheral edge and extending toward the end face of the packaging material and a second side portion with one end thereof intersecting substantially orthogonally with the first side portion and the other end intersecting substantially orthogonally with the longitudinal peripheral edge.

Growing community of inventors

Kyoto, Japan

Keiichi Takahashi