Kabushiki Kaisha Toshiba

Canon Kabushiki Kaisha

Yokogawa Electric Corporation

Tokyo Shibaura Denki Kabushiki Kaisha

Lazoc Incorporated

Keiichi Sasaki

Nobuo Hayasaka

Katsuya Okumura

Mie Matsuo

Naoto Takano

Yukihiro Hayakawa

Hiroki Tabata

Akira Sawada

Masato Kamiichi

Mitsuhiro Kamiya

Takuya Nidaira

Yoshimi Hisatsune

Manabu Kimura

Ershad Ali Chowdhury

Atsuko Sakata

Kenji Adachi

Hirotaka Nishino

Hiroshi Ikegami

Kanako Sawada

Toru Eto

Kazushige Kimura

Katsumi Kanehira

Yoko Todo

Koji Sakui

Tetsuo Endoh

Masashi Takahashi

Nobuyuki Suzuki

Satoshi Suzuki

Iwao Kunishima

Masanobu Ohmura

Daisuke Kaneko

Takeru Yasuda

Katsunori Hirota

Koichi Yoshimura

Tsutomu Tange

Akira Ohtani

Masao Yoshikawa

Yoshio Mochida

Daisuke Asakura

Yoshiei Tanaka

Shohei Matsumoto

Nobuo Yamaga

Norio Ahiko

Hiroaki Cho

Kenji Katori

Tadayoshi Murayama

Tatsuo Miyazawa

Takatoshi Nakahara

Masanobu Ohi

Yuuichi Machijima

Takehiro Shirai

Shigehito Kodera

Masaaki Ookubo

Hiromi Imai

Nobuo Uesugi

Mituaki Furudate

Hiroji Mizuguchi

Noriyuki Kurita

Tomohiro Migita

Lele Ding

A substrate storage structure includes a substrate and a housing configured to store the substrate. The housing includes a thickness direction regulator configured to regulate a position of the substrate from both sides in a thickness direction, a width direction regulator configured to regulate the position of the substrate from both sides in a width direction, and a length direction regulator configured to regulate the position of the substrate from both sides in a length direction. The housing includes a first portion and a second portion connected to the first portion. The first portion includes the thickness direction regulator and a part of the length direction regulator. The second portion includes the width direction regulator and another part of the length direction regulator. This substrate storage structure can allow easy assembly.

Substrate storage structure

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus

Wireless communication module

A module connection structure includes a first module, a second module connected to the first module via connectors, and fixing members that fix the second module to the first module. The fixing members are movable between a fixed position at which the second module is inseparable from the first module and an unfixed position at which the second module is separable from the first module. At least one of the first module and the second module has fixing member holders that hold the fixing members located at least at the unfixed position.

Module connection structure and measuring instrument

A measuring apparatus includes a base portion attachable to an attachment target object and a cover portion configured to be detachably attached to the base portion to accommodate a rod-shaped replaceable object inside the cover portion, and the cover portion includes a holding portion configured to hold the replaceable object with the cover portion attached to the base portion.

Measuring apparatus

In one embodiment, a pipe inspecting apparatus includes a selection module configured to select first and second ultrasonic optical probes from a plurality of ultrasonic optical probes attached to a pipe. The apparatus further includes a power supplying module configured to supply power to an ultrasonic transducer of the first ultrasonic optical probe to input an ultrasonic wave from the ultrasonic transducer to the pipe and to supply the ultrasonic wave via the pipe to an optical fiber sensor of the second ultrasonic optical probe. The apparatus further includes a light detection module configured to detect laser light transmitted through the optical fiber sensor of the second ultrasonic optical probe.

Optical fiber electromagnetic acoustic transducer pipe inspecting appartus and method

An imaging apparatus includes a substrate including a photoelectric conversion portion; and a silicon nitride layer arranged to cover at least a portion of the photoelectric conversion portion. The silicon nitride layer contains chlorine. An N/Si composition ratio in the silicon nitride layer is not less than 1.00 and is less than 1.33.

Imaging apparatus, method of manufacturing the same, and device

Sensor device

Wireless communication device

Radio equipment includes a substrate on which a first antenna for near field communication is provided, a base portion on which the substrate is erected, and a cover portion configured to be attached to the base portion so as to cover the substrate. The cover portion includes an opposing portion configured to oppose the first antenna and a non-opposing portion disposed closer to the base portion than the opposing portion in a direction in which the substrate is erected. A distance from an outer surface of the cover portion to the substrate at the opposing portion is shorter than a distance from the outer surface of the cover portion to the substrate at the non-opposing portion.

Radio equipment

Wireless sensor device

A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.

Print element substrate, method of manufacturing the same, printhead and printing apparatus

Growing community of inventors

Yokohama, Japan

Keiichi Sasaki