Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Atsushita Electric Industrial Co., Ltd.

Keiichi Nakao

Yukio Mizukami

Koji Shimoyama

Hiroaki Ishida

Hideyuki Okinaka

Noboru Mohri

Yukihiro Shimasaki

Masaaki Hayama

Toshiro Otobe

Atsushi Iwase

Suzushi Kimura

Masaaki Katsumata

Satoshi Tomioka

Naotugu Yoneda

Takumi Yamaguchi

Akira Hashimoto

Tsunetsugu Imanishi

Yasutaka Horibe

Koji Nakashima

Toshiyuki Nakata

Takashi Iguchi

Hikoji Okuyama

Yoshiyuki Miura

Akira Ohmi

Toshiyuki Taniguchi

Hitoshi Kouno

Masahiro Katoh

Koichi Aburata

Kyoushige Shimizu

Tohru Ohnishi

A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Combination of base layer and ink for inkjet for manufacturing electronic component

Method of manufacturing base layer, ink for inkjet and electronic components

Base layer for manufacturing an electronic component by an etching process

The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board

The invention presents a strain sensor includes a substrate, a crystallized glass laminated on the substrate, a strain sensitive resistor laminated on the crystallized glass, in which the crystallized glass is formed by baking a plurality of types of crystallized glass powder having different thermomechanical constants. As a result, the fluctuation of sensor characteristic is decreased, and the cost is lowered.

Strain sensor and method for manufacture thereof

A load sensor includes a substrate, a glass layer provided on the substrate, a wiring provided on the glass layer, an adjusting layer provided on the glass layer, and a strain-sensitive resistor element provided on the adjusting layer and connected to the wiring. A thermal expansion coefficient of the adjusting layer is closer to that of the strain-sensitive resistor element than that of the glass layer. In this load sensor, a stress remaining inside the resistor element is reduced, and the change over time of the resistance of the element is accordingly suppressed. Therefore, a single kind of the resistor element can be formed on substrates having respective thermal expansion coefficients, shapes, and thicknesses, thereby providing various load sensors having respective specifications.

Load sensor and its manufacturing method

A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.

Method of manufacturing strain sensor

The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, makes a glass layer of composite type as needed, and reduces uneven printing in printing multiple layers with use of hardening type paste.

Load sensor and method of manufacturing the load sensor, paste used for the method, and method of manufacturing the paste

Here disclosed is an ink jet apparatus having an ink-circulating/dispersing function. The apparatus provides ink with dispersion as required, and circulates the ink through a tube to an ink-collecting tank. During this circulation, a required amount of the ink is fed to a printer head to form a predetermined pattern on a surface of a substrate. By virtue of the circulating/dispersing function, the apparatus can cope well with easy-to-aggregate ink having poor stability in terms of printing, thereby protecting a printer head or an ink-spouting section from clogging during ink jet printing. Such stabilized ink jet printing contributes to manufacturing highly reliable electronic components with an increased yield of products.

Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink

A strain sensor includes a metal plate, a first glass layer on the metal plate, a second glass layer provided on the first glass layer and having a color different from that of the first glass layer, an electrode on the second glass layer, a strain-sensitive resistor on the second glass layer, a circuit pattern on the second glass layer for connecting the electrode to the strain-sensitive resistor, and an overcoat glass layer for covering the strain-sensitive resistor and the circuit pattern. The strain sensor allows the layers to be identified while being manufactured, hence being controlled easily in its manufacturing processes.

Strain sensor and production method therefor

Strain sensor and method of producing the same

A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 &#x3bc;m or more to 10 &#x3bc;m or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.

Method of forming an electronic component using ink

A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

Method of producing electronic parts, and member for production thereof

A manufacturing method of ceramic multi-layer boards including a step of forming adhesive layer ( ) on ceramic board ( ), and adhesive layer ( ) integrates board and ceramic green sheet . Little shrinkage in an in-plane direction is observed after firing, so that the ceramic multi-layer boards having highly dimensional accuracy are manufactured.

Method for manufacturing ceramic multi-layered board

A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 &mgr;m or more to 10 &mgr;m or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.

Growing community of inventors

Osaka, Japan

Keiichi Nakao