Sony Corporation

Sony Chemicals Corporation

Sony Chemical & Information Device Corporation

Keiichi Naito

Yutaka Kaneda

Toshihiro Shinohara

Yoshio Fujiwara

Soichiro Kishimoto

Tooru Odashima

Yoshinobu Fujimoto

Tomohiko Sada

Makoto Nishimura

Masanao Watanabe

Naotake Kobayashi

Tooru Odajima

An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching maskis formed on the bump formation sideof a metal foilhaving a thickness (t+t) equal to the sum of the thickness tof a wiring circuitand the height tof the bumpsto be formed on a wiring circuit, the bumpsare formed by half-etching the metal foilfrom the bump formation etching maskside down to a depth corresponding to a predetermined bump height t, and a metal thin film layercomposed of a different metal from the metal foilis formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Method for manufacturing a bump-attached wiring circuit board

An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask () is formed on the bump formation side () of a metal foil () having a thickness (t+t) equal to the sum of the thickness tof a wiring circuit () and the height tof the bumps () to be formed on a wiring circuit (), the bumps () are formed by half-etching the metal foil () from the bump formation etching mask () side down to a depth corresponding to a predetermined bump height tand a metal thin film layer () composed of a different metal from the metal foil () is formed on the bump formation side of the metal foil (), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching maskis formed on a bump-forming surfaceof a metal foilwhich has a thickness that is the sum of the thickness tof the wiring circuitand the height tof the bumpswhich are to be formed on the wiring circuit(tt), and then the bumpsare formed by half-etching the metal foilto a depth corresponding to the desired bump height tfrom the bump-formation etching maskside, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Method for manufacturing wiring circuit boards with bumps and method for forming bumps

Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask is formed on a bump-forming surface of a metal foil which has a thickness that is the sum of the thickness t of the wiring circuit and the height t of the bumps which are to be formed on the wiring circuit (t &plus;t ), and then the bumps are formed by half-etching the metal foil to a depth corresponding to the desired bump height t from the bump-formation etching mask side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

A bump formation etching mask is formed on the bump formation side of a metal foil having a thickness (t &plus;t ) equal to the sum of the thickness t of a wiring circuit and the height t of the bumps to be formed on a wiring circuit. The bumps are formed by half-etching the metal foil from the bump formation etching mask side down to a depth corresponding to a predetermined bump height t A metal thin film layer formed of a different metal from the metal foil is formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations, such as plating pretreatments.

Bump-attached wiring circuit board and method for manufacturing same

The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.

Non-flammable adhesive compositions

A method for the manufacture of an adhesive suitable for use with polyvinylfluoride sheets which includes the steps of copolymerizing a vinyl compound and a vinyl compound having an epoxy group and then treating the copolymer thus produced with aqueous ammonia to aminate the epoxy group.

Method of manufacturing an adhesive

A thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards, consists essentially of an acryloyloxyl- or methacryloyloxyl- terminated butadiene homopolymer or copolymer, for example, with acrylonitrile or styrene, an ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxyl or methacryloyloxyl groups of the butadiene homopolymer or copolymer, and an acid anhydride containing at least one ethylenically unsaturated group in its molecule. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of the butadiene homopolymer or copolymer, and the amounts of the ethylenically unsaturated monomer and of the acid anhydride are from 50 to 200 weight percent and from 5 to 20 weight percent, respectively, based on the weight of the terminated butadiene homopolymer or copolymer. A particularly desirable composition is obtained when the acryloyloxyl- or methacryloyloxyl-terminated polymer or copolymer is at least 70 weight percent 1,2-polybutadiene.

Thermosetting acryloyloxy-terminate butadiene polymers

A flame retardant thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards composed essentially of acryloyloxy- or methacryloyloxy-terminated butadiene homopolymer or butadiene copolymer with, for example, acrylonitrile or styrene, ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxy- or methacryloyloxy- groups of the butadiene homopolymer or copolymer, which monomer has a substantial amount of haloaryl, and acid anhydride having at least one ethylenically unsaturated group. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxy- or methacryloyloxy- groups per molecule of the butadiene homopolymer of copolymer, the amounts of ethylenically unsaturated monomer and of acid anhydride are from 150 to 500 weight percent and from 5 to 20 weight percent, respectively, based on the weight of terminated butadiene homopolymer or copolymer, and the amount by weight of halogen is 25 to 70 percent of the weight of the composition. A particularly desirable composition is obtained when the acryloyloxy- or methacryloyloxy-terminated polymer or copolymer is at least 70 weight percent 1,2-polybutadiene; chlorine and bromine are the halogens, bromine being preferred.

Growing community of inventors

Kanuma, Japan

Keiichi Naito