Japan Aviation Electronics Industry, Limited

Olympus Corporation

Olympus Optical Company, Ltd.

Eastman-kodak Company

Hosiden Corporation

Keiichi Mori

Yoshichika Kato

Yoshihiko Hamada

Osamu Imaki

Kenji Kondou

Satoshi Yoshida

Hideaki Yoshida

Yukihiro Kuroda

Yuichi Gomi

Seisuke Matsuda

Takayuki Kijima

Shuichi Aihara

Takayoshi Yamauchi

Masuo Nishimoto

Osamu Hashiguchi

Akira Watanabe

Hideo Sugimoto

Hitoshi Hashimoto

Satoshi Kai

Eiichi Asami

Koji Kato

Keiji Kunishige

Toshiyuki Noguchi

Junzo Sakurai

Kenichi Nakajima

Atsushi Kohashi

Ryoji Kaku

Sumito Yoshikawa

Ryuji Hirata

Mitsuo Ukechi

Mitsugi Kajikawa

Taishin Yoshida

Takao Mase

Ayumi Takahashi

Akihiro Homma

Toshiya Isobe

Toshihiro Yonemitsu

Yukio Kawahara

In an optoelectrical connector including two connectors to be interconnected, each having at least one optical connection part and at least two electrical connection parts, the electrical connection parts of one of the connectors are pins and the electrical connection parts of the other connector are spring contacts. The connector having the spring contacts includes, before the spring contacts, positioning holes in which the pins are to be inserted. The tips of the pins come into contact with the spring contacts to make electrical connection. The bases of the pins fit in the positioning holes to perform positioning for optical connection. The optoelectrical connector can be smaller, lighter, and thinner.

Optoelectrical connector and portable electronic device

An optical module is formed of a first optical block and a second optical block each equipped with a lens the optical axis of which needs to be aligned, the blocks being positioned and secured to each other, and has stepwise positioning means. A positioning means includes spring pieces each having an abutting slope, and edges. Four spring pieces are formed in the second optical block such that their abutting slopes are disposed at four corners of the second optical block. Positioning is implemented when the abutting slopes meet the edges of the first optical block. Another positioning means includes a depressed part and a guide slope formed in one of the two optical blocks and a raised part formed in the other optical block. The raised part is fitted into the depressed part.

Optical module

A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the substrate surface and stationary parts that are fixedly secured to the single-crystal silicon substrate with an insulating layer sandwiched between. Depressions are formed in the surface regions of the single-crystal silicon substrate where no stationary parts are present and the movable parts are positioned above the depressions. The depressions form gaps large enough to prevent foreign bodies from causing shorts and malfunctioning of the movable parts.

Method of making microminiature moving device

A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the substrate surface and stationary parts that are fixedly secured to the single -crystal silicon substrate with an insulating layer sandwiched between. Depressions are formed in the surface regions of the single-crystal silicon substrate where no stationary parts are present and the movable parts are positioned above the depressions. The depressions form gaps large enough to prevent foreign bodies from causing shorts and malfunctioning of the movable parts.

Microminiature moving device

In an XY address type solid-state imager apparatus comprising a solid-state imager having a plurality of pixels two-dimensionally arranged, and horizontal and vertical scanning circuits to read signals of the pixels, the scanning circuits each have a progressive scanning circuit to progressively read pixel signals by a first scanning control signal, and an interlace scanning circuit to read pixel signals with an interlaced manner by a second scanning control signal different from the first scanning control signal, and arbitrarily carries out combining of progressive reading and interlace reading in one frame in accordance with a combination of the respective scanning control signals, and reads pixel signals.

Solid-state imager apparatus which carries out both progressive scanning and interlace scanning in one frame by an arbitrary combination, and a camera using the solid-state imager apparatus

A solid-state image sensing apparatus having output channels CHand CHhas first and second driving modes in which pixel signals of pixels in the same image sensing area are read out. The number of output channels to be used is changed between the first driving mode and the second driving mode. In at least one of the two modes, the phase of the read timing of pixel signals of pixels adjacent in the horizontal direction is shifted by a predetermined amount.

Solid-state image sensing apparatus and method of reading image signal using a plurality of output channels

There is provided an electrostatic actuator with the interdigitated electrode structure comprising a movable roddisposed in parallel with an alignment axis line Ox predetermined on a substrate; a movable interdigitated electrodefixed on the both sides of a coupling pointC on the movable rodand having a plurality of movable electrode fingers; fixed interdigitated electrodesfixed to the substrate and having a plurality of fixed electrode fingers; and four hingeswhose one ends are anchored respectively to the movable rod and the other ends are anchored to anchoring pointsA-D of the substrate. Lengths of those hinges are longer than distances from anchoring points to the alignment axis line and a displacement Lc of a coupling pointC in a direction orthogonal to the alignment axis line is reduced to be smaller than a distance between the respective movable electrode fingers and the closest fixed electrode finger.

Electrostatic actuator with interdigitated electrode structure

Marker grooves of an optical fiber are formed by a marker groove forming device including at least, on a substrate, a fiber guide and optical fiber pressing springs formed on a side wall surface in the fiber guide. The optical fiber pressing springs include edges contacted and pressed to the side of an optical fiber stored in the fiber guide, and plate springs for pressing the edges to the side of the optical fiber with fulcra on the side wall surface in the fiber guide. The optical fiber is pressed to a side wall surface in the fiber guide, and the edges are formed at a predetermined distance from each other.

Marker groove forming device

A micro-optic device including a complicate structure and a movable mirror is made to be manufactured in a reduced length of time. A silicon substrate and a single crystal silicon device layer with an intermediate layer of silicon dioxide interposed therebetween defines a substrate on which a layer of mask material is formed and is patterned to form a mask having the same pattern as the configuration of the intended optical device as viewed in plan view. A surface which is to be constricted as a mirror surface is chosen to be in a plane of the silicon crystal. Using the mask, the device layer is vertically etched by a reactive ion dry etching until the intermediate layer is exposed. Subsequently, using KOH solution, a wet etching which is anisotropic to the crystallographic orientation is performed with an etching rate which is on the order of 0.1 &#x3bc;m/min for a time interval on the order of ten minutes is performed to convert the sidewall surface of the mirror into a smooth crystallographic surface. Subsequently, the intermediate layer is selectively subject to a wet etching to remove the intermediate layer only in an area located below the movable part of the optical device.

Method of manufacturing micro-optic device

Method of forming an optical fiber

An imaging apparatus comprises an imaging element, an imaging optical system configured to input an image of an object to the imaging element, a non-volatile memory part for storing defect data concerning the imaging element, and includes a first memory area storing initial defect data concerning the imaging element, and a second memory area different from the first memory area, a defect detection part for detecting defect data concerning the imaging element, and a control part for controlling reading and writing of the defect data on the imaging element from and to the non-volatile memory part, the control part writing, to the second memory area, defect data detected by the defect detection part.

Imaging apparatus that detects pixel defect of an imaging element and imaging method

Image apparatus, driving method, and camera

A micro-optic device including a complicate structure and a movable mirror is made to be manufactured in a reduced length of time. A silicon substrate and a single crystal silicon device layer with an intermediate layer of silicon dioxide interposed therebetween defines a substrate on which a layer of mask material is formed and is patterned to form a mask having the same pattern as the configuration of the intended optical device as viewed in plan view. A surface which is to be constructed as a mirror surface is chosen to be in a plane of the silicon crystal. Using the mask, the device layer is vertically etched by a reactive ion dry etching until the intermediate layer is exposed. Subsequently, using KOH solution, a wet etching which is anisotropic to the crystallographic orientation is performed with an etching rate which is on the order of 0.1 &#x3bc;m/min for a time interval on the order of ten minutes is performed to convert the sidewall surface of the mirror into a smooth crystallographic surface. Subsequently, the intermediate layer is selectively subject to a wet etching to remove the intermediate layer only in an area located below the movable part of the optical device.

Micro-optic device and method of manufacturing same

The present invention provides a digital camera that is capable of capturing a picture in which the brightness between a main subject and a nighttime background are well balanced. When an image capture instruction is received while a night scene portrait mode is set, in a pixel addition output mode, an image sensoris set to a high sensitivity state by performing pixel addition, and outputs low resolution non-flash image data. Further, in an overall pixel output mode, the image sensoroutputs high resolution flash image data in a low sensitivity state without performing pixel addition. Next, a resolution conversion circuitconverts a resolution of non-flash image data to be equivalent to a resolution of flash image data. Then, an image combining circuitadds respective pixel values of corresponding pixels in the non-flash image data and the flash image data having the same resolution and combines both sets of image data to generate image data for recording.

Digital camera, image capture method, and image capture control program

Growing community of inventors

Tokyo, Japan

Keiichi Mori