Nok Corporation

Nippon Mektron Limited

The University of Tokyo

Keiichi Miyajima

Tomoko Nakano

Naohiro Fujisawa

Takahiro Hayashi

Makoto Hora

Kenji Minoshima

Takeshi Yamada

Tomohiro Inoue

Teruo Fujii

Takayuki Komori

Yutaka Kouda

Shinji Okawa

Takashi Sasaki

SooHyeon Kim

An extracellular potential measurement device includes multiple insulating films each of which is made from an electric insulating material, the insulating films being stacked and bonded to each other; and multiple electrode wires each of which is made from an electroconductive material, the electrode wires being arranged in multiple heights. Each of the electrode wires is interposed between an upper insulating film and a lower insulating film. Each of the insulating films, except for a lowermost insulating film, has an opening penetrating the insulating film. The opening in a lower insulating film has a size that is less than that of the opening in an upper insulating film, the openings in the insulating films being overlapped to form a recess having a size reducing downward, the recess being adapted to store a collection of cells. Each of the electrode wires has an end that is located near an opening in an insulating film that is immediately below the electrode wire, the ends being exposed in the recess.

Extracellular potential measurement device

Provided is an IC tag favorably applicable even to linen products. An IC tagusing a magnetic field type tag unitin which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film, a cover film, and a protective film); and an auxiliary antennaformed on the film, wherein the magnetic field type tag unitis fixed to the film by an adhesivewith elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna

Flexible IC tag

Integrated circuit tag

There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tagincludes a film member, an antenna partprovided on the film member, an IC chipmounted on the film memberin such a way as to be connected with the antenna part. A slitis provided at a position away from the antenna partin the region on the film membernear the site at which the IC chipis mounted, and a coveringmade of an elastic material is provided to cover at least the entire area of the IC chipand a portion of connection of the IC chipand the antenna part

IC tag

The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tagis provided with a coveringmade of an elastic material, which covers at least the side of the IC tagon which an IC chipis mounted and has a thickness that is larger in its portionthat covers a region about the IC chipthan in its portionthat covers a region outside the region about the IC chip. The coveringis configured in such a way that at least a part of a boundary of the portionof the covering that covers the region about the IC chipand the portionof the covering that covers the region outside the region about the IC chiphas a curved shape.

In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.

Seal structure for electronic equipment

To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.

Sealing structure

To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.

Seal structure

To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.

To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.

An electromagnetic wave shielding gasket comprising a gasket body integrated with an electroconductive non-woven fabric or woven fabric, a seal part being provided, while avoiding the area of the electroconductive non-woven fabric or woven fabric, where the gasket body, preferably a gasket body with a lip-shaped projection, is integrated at the edge with the electroconductive non-woven fabric or woven fabric, and particularly preferably an annular gasket body with a lip-shaped projection is integrated at the inner peripheral edge with the outer peripheral edge of the annular body of the electroconductive non-woven fabric or woven fabric.

Growing community of inventors

Fujisawa, Japan

Keiichi Miyajima