Sony Corporation

Ricoh Company, Ltd.

Nikon Corporation

Sony Group Corporation

Keiichi Kimura

Takashi Miyoshi

Masami Takai

Koji Kamiya

Shigeaki Maruyama

Shigeki Motoyama

Ivan Poupyrev

Masaaki Aoyama

Norio Kaneko

Yoshinori Ishii

Keiji Saratani

Takayoshi Kawazoe

There is provided a signal input unit to prevent or reduce an increase in memory hardware on a transmitter or a receiver of a serial digital signal, and to decrease the load on a CPU. The signal input unit receives as an input a video signal and a digital signal for transmission, the digital signal for transmission including a data packet with metadata associated with the video signal. The data writing unit extracts predetermined metadata from the digital signal for transmission on the basis of metadata-specifying information and writes the extracted metadata in an accumulating register. For example, the metadata-specifying information includes header information of the data packet with the predetermined metadata. For example, the header information includes classification information indicating a classification for the predetermined metadata and auxiliary information of the predetermined meta-information.

Signal processing apparatus and signal processing method

An input device includes a touch panel with which a user performs an input operation of information by touching the touch panel. The input device further includes a vibration generation device for feeding back, to the user, various kinds of sense of touch in accordance with the type of the information through the touch panel. Additionally, the input device includes a vibration control circuit for allowing the vibration generation device to generate various forms of vibrations in accordance with the type of the information. The vibration generation device is a bimorph piezoelectric actuator including a first actuator unit and a second actuator unit stacked on the first actuator unit in which when one of the first and second actuator units expands, the other contracts. Further, each of the first and second actuator units has a multi-layered piezoelectric element layer.

Input device and electronic device using the input device

A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Semiconductor device and voltage regulator

In a planarization process with a CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process, such as a CMP processing or an aspheric lens polishing process, the polishing method is performed by forming an aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions, and the irradiated laser light forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Polishing apparatus

In planarization process with CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process such as CMP processing or an aspheric lens polishing process, the polishing method is performed by forming aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions and forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Polishing method and polishing apparatus

In a Chemical Mechanical Polishing flattening processing against a surface with minute bumps and dips in a semiconductor process, this invention provides a method of polishing to be able to perform selective polishing of the bumps. A laser beam is irradiated selectively on the surface of a work piece in accordance with a shape of minute bumps and dips on the surface of the work piece, thereby performing a removal control for the minute region and enabling to selectively polish particularly surface bumps.

Method and apparatus for polishing

A holder which cleanly holds an article such as a semiconductor wafer and which is high in rigidity, light in weight, high in dimensional stability and excellent in dust resistance. The wafer holder includes a vacuum holding surface formed with a plurality of concentric or helical annular projections and annular vacuum holding grooves which are arranged at a given pitch. A plurality of vacuum holes for vacuum holding purposes are formed in the respective annular grooves so as to be arranged radially and each of the vacuum holes is subjected to pressure reduction by a vacuum source through the interior of the holder, thereby correcting the flatness of a wafer to conform with the upper surfaces of the annular projections. At least the portions of the holder which contact with the wafer (preferably the holder on the whole) are made of a sintered ceramic containing covalent bond-type conductive material such as a TiC-containing sintered Al.sub.2 O.sub.3 so that the contact portions exhibit conductivity and also less pores are present in the surface, thereby practically preventing the occurrence and deposition of fine particles.

Holding apparatus for holding an article such as a semiconductor wafer

A probe has a vibration excitor including a core member made of a giant magnetostrictive material and magnetic field generation means for generating an alternating magnetic field having a randomly varying frequency to thereby expand and compress the core member to generate random vibration therein, and an impedance head for detecting an acceleration of the random vibration and a vibration stress created in organism tissue vibrated by the vibration excitor and generating electrical signals proportional thereto. A viscoelasticity measurement device using the above probe for the organism tissue is also disclosed.

Growing community of inventors

Kanagawa, Japan

Keiichi Kimura