Nitto Boseki Co., Ltd.

Keiichi Kato

Shin Kasai

Hirokazu Inoguchi

Yutaka Kawaguchi

Hideharu Waketa

Shoichi Watanabe

Mikiya Fujii

Junichi Saito

A raveling-preventing agent for a glass fiber woven fabric, which contains as essential components a reaction product from an epoxy resin having an epoxy equivalent of 150 to 1,000 and a molecular weight of 500 to 2,000 and a hydroxyl group-containing amine compound, and an isocyanate curing agent. The raveling-preventing agent firmly binds glass fibers together and prevents the raveling of edge-forming warp yarns when applied to sectioned marginal portions of a glass fiber woven fabric. Further it is free from swelling in a solvent used in a thermosetting resin varnish.

Raveling-preventing agent for glass fiber woven fabric, and glass fiber

A woven material of inorganic fiber, and a process for making the same, are disclosed in which exposed surfaces of warps and wefts constituting the woven material are opened as a result of being impinged by jets of pressurized water, whereby the fibers on the surface of the woven material are uniformly raised.

Woven material of inorganic fiber and process for making the same

The present invention provides a method for producing a glass cloth which is suitable as a reinforcing material for making resin laminates and which comprises subjecting filaments of glass fibers to a sizing treatment with a sizing agent containing at least one water-soluble film forming agent selected from the group consisting of an amine-modified epoxy resin, an ethylene oxide-added epoxy resin and ethylene oxide-added bisphenol A as film forming component, forming glass yarns from the thus treated filaments, weaving the glass yarns to make a glass cloth, washing the glass cloth with water until the loss of ignition of the sizing agent to the glass cloth reaches 0.25% by weight or less, and then treating this glass cloth with a solution of a surface treating agent.

Method for producing treated glass cloth

A fabric for a printed circuit-board characterized by that it is composed of one or more fiber(s) selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber, and glass fiber, and a printed circuit-board employing the fabric as its base material.

Printed circuit-board and fabric therefor

Disclosed is a woven fabric used for production of fiber-reinforced thermoplastic resin laminates wherein each or warps and wefts which constitute the fabric comprises at least one kind of thermoplastic resin yarns and at least one kind of reinforcing yarns and the reinforcing yarns of the warps and wefts as such constitute a weave. The weave constituted of only the reinforcing yarns is preferably a plain weave. The fiber-reinforced thermoplastic resin laminates made by compression molding a laminate of said woven fabrics are high in strength.

Woven fabric for fiber-reinforced thermoplastic resin laminate

In a substrate of a printed circuit, a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics impregnated with synthetic resin, and heated and pressed. Warps and wefts of the glass fiber fabrics filamentated their filaments. The synthetic resin enters gaps among the opening filaments so that the vertically laminated glass fiber fabrics including the opening fibers are integrally jointed with each other. Warps and wefts of the glass fiber fabrics may have their surfaces made fuzzy so that the synthetic resin enters fuzzy filaments. Furthermore, the thus produced substrate may be used as a multilayer printed circuit substrate.

Growing community of inventors

Fukushima, Japan

Keiichi Kato