Hitachi Chemical Company, Ltd.

Resonac Corporation

Keiichi Kasuga

Tomio Iwasaki

Koji Morita

Kazuhito Kobayashi

Chihiro Hayashi

Ryo Shimokawa

Shinichi Kawasumi

Shinji Tsuchikawa

A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xrepresents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rand Reach independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5).

Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module

An organic material removing device includes: a container for storing a composite material containing an inorganic material and an organic material decomposable by a treatment liquid; a treatment tank including an accommodation portion for accommodating the container, a treatment liquid inflow portion for allowing the treatment liquid to flow in, and a treatment liquid outflow portion for allowing the treatment liquid to flow out; temperature control means for heating or cooling the treatment liquid; and a treatment liquid circulation means for allowing the treatment liquid to flow in from the treatment liquid inflow portion into the treatment tank and allowing the treatment liquid in the treatment tank to flow out from the treatment liquid outflow portion.

Organic material removing device

Growing community of inventors

Tokyo, Japan

Keiichi Kasuga