Murata Manufacturing Co., Ltd.

Keiichi Inoue

Mamoru Ogawa

Takashi Noji

Hiroyuki Kanitani

A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.

Method for fabricating ceramic electronic parts

Electronic components are held in first holding portions distributed along a peripheral edge portion of a first rotor, which in turn is intermittently rotated to provide the electronic components with markings. Then, ink providing the markings is cured on a supply track extending from the first rotor toward a second rotor. The electronic components held by the second rotor are successively supplied into cavities of a receiving tape along intermittent rotation of the second rotor. An apparatus for providing the markings comprises a printing plate having printing surfaces, a platen for supporting the electronic components, and a back support, elastically displaceably holding the platen, which can approach to and separate from the printing surfaces.

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Kyoto, Japan

Keiichi Inoue