Adv Antest Corporation

Keiichi Fukumoto

Noriyuki Igarashi

Hiroyuki Takahashi

Yutaka Watanabe

Kenichi Shimada

Hiroto Nakamura

Noboru Saito

Toshiyuki Kiyokawa

A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Cooling fin connected to a cooling unit and a pusher of the testing apparatus

A constant temperature chamber to be disposed in a handler for use with an IC tester is provided which is capable of preheating semiconductor devices to be measured to a preset temperature uniformly and in a short time. A rotary stage adapted to rotate with semiconductor devices to be measured loaded thereon is disposed in the bottom of the constant temperature chamber enclosed by thermal insulation walls. A heater is disposed in the upper portion of the constant temperature chamber. An axial-flow fan is positioned between the heater and the rotary stage. Further, a tubular flow-rectifying member is disposed surrounding and in proximity to the outer periphery of the axial-flow fan. A gas flow produced by rotatively driving the axial-flow fan is rectified by the flow-rectifying member with no turbulences occurring, and a circulating rectified gas flow is thereby formed from the axial-flow fan to pass through the rotary stage, and then advancing radially outwardly through between the undersurface of the rotary stage and the bottom thermal insulation wall of the constant temperature chamber, followed by rising in swirling streams along the interior of the thermal insulation walls of the chamber and flowing back to the axial-flow fan.

Constant temperature chamber in a handler for semiconductor device

A device handler prevents a dropping of a device chuck mounted to a rotary arm owing to a breaking of a coil spring and a stoppage of the device chuck at an elevation in the mid way of vertical movements owing to a defect or failure of a linear guide, preventing the device chuck and/or an exit stage from being damaged or broken. A first guide rail is provided along a downwardly inclined camming surface of a cam member extending from the vicinity above a soak stage to a vicinity above a measuring section, and a second guide rail is provided along an upwardly inclined camming surface of the cam member extending from the vicinity above the measuring section to the vicinity above the exit stage. In addition, on the opposite side of a cam holder about the rotary shaft of the rotary arm unit is placed an arcuate dropping preventive plate mounted to the props depending from the ceiling insulation wall of the constant temperature chamber like the cam holder. Further, a hook is mounted to the upper portion of each of the device chucks. The hook can slide on any one of the first guide rail, the second guide rail, and the dropping preventive plate in the manner engaged therewith when an accident occurs.

Structure of rotary arm and device chuck part of a device handler

A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with the constant temperature chamber 20 of the IC handler is configured to be detachable with respect to the base 10a of the body of the IC handler, and a socket guide 70 having IC sockets mounted therein is also configured to be detachable with respect to the mounting fixture 62. With this construction, it is possible to minimize the length of the electric path between the performance board 35 and the terminals of the IC sockets. In addition, the IC sockets may be mounted even directly on the performance board 35. It is thus possible to carry out the testing utilizing all types of test heads by preparing various mounting fixtures matching with the test heads used.

Test section for use in an IC handler

An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test head of the IC tester or the IC handler. The spacing frame and the temperature chamber provide a unique structure which is capable of inserting and replacing the spacing frame within a vertical space in the chamber and locking the spacing frame in the predetermined position in the chamber. The spacing frame structure includes a spacing frame body to interface the IC handler and the IC tester which has a socket guide at its top which is horizontally extended from the body and a flange at its middle portion, a temperature chamber having an opening for receiving said spacing frame body therein, a performance board connected to a bottom of the spacing frame body for providing electric signals from the IC device to be tested to the IC tester, an IC socket for receiving the IC device to be tested therein, and a locking mechanism to provide a vertical movement to the spacing frame body such that the spacing frame body is free when it is in an upper position and is locked when it is in a lower position.

Spacing frame structure for IC handler

transport mechanism for integrated circuit (IC) handlers with four transport stations spaced 90.degree. apart on one circumference are supported by a cross-shaped contact arm, and below the circumference, contact-in, contact or test and contact-out stages are provided at intervals of 90.degree.. Each transport station has a vertically movable air chuck unit and an air chuck driving mechanism for driving the air chuck unit vertically and holding by suction and releasing devices under test. The transport station that has reached a predetermined position above the contact-in stage presses the air chuck unit down with the air chuck driving mechanism and suck and lifts the devices to be tested off the contact-in stage. In parallel with the operation at the contact-in stage, the transport station, staying above the contact or test stage, lowers the air chuck unit which holds devices to be tested and fixes them onto the contact or test stage to start testing them, and the transport station above the contact-out stage lowers the air chuck unit holding tested devices and releases them onto the contact-out stage, thereafter raising the empty air chuck unit. Each time the contact arm is turned 90.degree., these operations are repeated.

Growing community of inventors

Kitamoto, Japan

Keiichi Fukumoto