Olympus Corporation

Keiichi Asami

Junichi Okubo

Takehiro Ishikawa

Provided is a method of bonding an operation wire used in a medical equipment. The method includes: locally heating an adjacent region of a bonding region of an operation wire to generate an oxide in the adjacent region of the operation wire; coating the bonding region and the adjacent region with flux to remove an oxide in the bonding region and the oxide in the adjacent region; inserting a bonding end portion of the operation wire into a through-hole of a coupling material; injecting a melted bonding material into between the coupling material and the operation wire to integrally bond the coupling material and the operation wire such that the oxide remaining in the adjacent region prevents wet-spreading of the bonding material.

Method of bonding operation wire and medical equipment

An optical unit includes: a first optical device holding body that is sleeve-shaped and includes a first holding portion configured to hold therein at least one first optical device, and a first fitting portion extending from the first holding portion; a second optical device holding body that is sleeve-shaped and includes a second holding portion configured to hold therein at least one second optical device, and a second fitting portion extending from the second holding portion; and a welded portion that is melted and solidified over the first fitting portion and the second fitting portion in an overlapping portion between the first fitting portion and the second fitting portion. A first welding width at a center of the first fitting portion and a second welding width at a center of the second fitting portion are substantially identical in the optical axis direction of the optical unit.

Growing community of inventors

Hachioji, Japan

Keiichi Asami