Fujimi Incorporated

Keigo Ohashi

Hitoshi Kodama

Hitoshi Morinaga

Kazusei Tamai

Noritaka Yokomichi

Hideki Otake

Taira Otsu

Yutaka Niwano

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

Polishing tool and polishing method for member having curved surface shape

There is provided a polishing composition, containing abrasive grains and an acid represented either by R&#x2014;R&#x2014;SOH (wherein Ris a linear alkylene or hydroxyalkylene group having 1 to 4 carbon atoms, and Ris a hydroxy group, a carboxy group, or a sulfonic acid group when Ris the linear alkylene group, or Ris a carboxy group or a hydroxymethyl group when Ris the linear hydroxyalkylene group), or by CH&#x2014;R(wherein Ris a sulfonic acid group or a phosphonic acid group). The acid contained in the polishing composition is preferably isethionic acid or benzenesulfonic acid. The polishing composition is mainly used in the application of polishing silicon oxide materials including glass substrates for hard disks, synthetic quartz substrates for photomasks, and low-dielectric-constant films such as silicon dioxide films, BPSG films, PSG films, FSG films, and organosiloxane films of semiconductor devices.

Polishing composition and polishing method using the same

Polishing composition and method for producing a memory hard disks

A polishing composition for polishing a memory hard disk, which comprises water and at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide and which further contains an iron chelate complex dissolved in the composition, the iron chelate complex having a nitrogen-containing compound as a ligand, and the pH of the entire composition being from 6 to 10.

Polishing composition

A polishing composition for polishing a memory hard disk comprising water and at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, which further contains an iron compound dissolved in the composition, said iron compound being selected from the group consisting of iron(III) nitrate, iron(III) sulfate, ammonium iron(III) sulfate, iron(III) perchlorate and an ion salt of an organic acid.

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Aichi, Japan

Keigo Ohashi