Olympus Corporation

Fukui Prefectural Government

Keigo Ito

Tadashi Watanabe

Shinji Suesada

Tetsuhiko Murakami

A braider includes: a plurality of cylindrical bobbins around which flat foil yarns are wound so as not to be inverted; a plurality of carriers to which the bobbins are rotatably attached, the plurality of carriers being configured to feed out the flat foil yarns from the bobbins; a core material supply mechanism configured to supply a core material to be placed inside the outer conductor; a waveguide take-out mechanism configured to take out the flexible waveguide after the outer conductor is formed; and a carrier movement determination mechanism configured to determine movement of the carriers so that there are always three or more cross points formed by the individual flat foil yarns with other ones of the flat foil yarns in an enlarged portion before the flat foil yarns form a braided shape.

Braider and method of manufacturing flexible waveguide

A flexible waveguide includes an inner dielectric, and a flexible external conductor disposed in a position covering an outer periphery of the dielectric, the flexible waveguide conducting a radio wave in a frequency band equal to or longer than a millimeter wave or a submillimeter wave near 60 GHz or more. The external conductor includes a metal layer, the metal layer has a shape displacement structure, a shape of an inner periphery side section of which faces the inner dielectric and is cyclic in the waveguide longitudinal direction, the shape displacement structure being a cyclic structure satisfying &#x3bb;mr&#x3c;&#x3bb;ch, where &#x3bb;mr represents a center wavelength of a main reflection band due to the cyclic structure and &#x3bb;ch represents a cutoff wavelength in a high-order mode of the waveguide.

Waveguide, image transmission apparatus including waveguide, endoscope including waveguide, and endoscope system

A molded interconnect device adapted to form a three-dimensional circuit by using laser beams includes: a main body on which the three-dimensional circuit is formed; and a lead portion connected to an external electrode of an external substrate by solder and extending from the main body. The lead portion includes: a lead main body molded from a material same as a material of the main body; and a metal film formed on at least a part of an outer periphery of the lead main body.

Growing community of inventors

Nagano, Japan

Keigo Ito