Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Keigo Fukunaga

Satoshi Nishikawa

Koichi Akiyama

Takashi Yumura

Hiroshi Kigawa

Yosuke Suzuki

Tamio Matsumura

Naoya Ogawa

Yohei Hokama

Yuichiro Horiguchi

Yoichi Nagase

A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion. The driver is configured to drive the holder in such a manner that the workpiece can revolve around the optical axis of the laser beam at the first portion. Accordingly, the workpiece can be processed, and debris of the workpiece can be prevented from adhering to the main surface of the workpiece.

Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus

An optical semiconductor device includes a semiconductor substrate, a first semiconductor layer provided on the semiconductor substrate, and a mesa waveguide provided on the principal surface of the first semiconductor layer. The semiconductor device also includes a buried layer covering the upper surface of the first semiconductor layer. Part of the upper surface of the first semiconductor layer is exposed. A mesa structure provided at the boundary between a part of the first semiconductor layer is covered with the buried layer and a part of the first semiconductor layer is exposed. One side of the mesa structure is covered with the buried layer, and the other side is exposed. The optical semiconductor device can reduce the generation of stress in the buried layer, for example, to suppress the occurrence of cracks in the buried layer and enhance the reliability.

Optical semiconductor device and method for manufacturing the same

In a drum winding unit, a cylindrical drum winding a wire is supported by paired supports fixed to a base structure so the drum freely rotates about a central axis of the drum. A drive unit for rotating the drum is disposed inside the drum. The drive unit is insertable into and extractable from the drum while keeping the drum and the supports in their operating positions.

Drum winding apparatus

In a hoisting winch, a winding drum is arranged in an outer peripheral portion of a motor portion, a braking unit and an encoder are arranged on one end side of a rotor axis of the motor portion, an internal gear is fitted to an inner diameter area of the winding drum, a reduction mechanism in which planet gears are arranged between a sun gear and the internal gear is provided, the reduction mechanism, the braking unit, and the encoder are arranged in a coaxial fashion, and a wire rope fitting groove is provided on the winding drum on the braking unit side.

Hoisting winch for lifting and lowering

Growing community of inventors

Tokyo, Japan

Keigo Fukunaga