Seiko Epson Corporation

Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Kei Yamaguchi

Yuji Ichimura

Daisuke Matsumoto

Masami Kuroda

Katsumichi Ueyanagi

Yuko Nakamata

Noriaki Kawata

Kazunori Saito

Shigeru Shinoda

Motohiro Takeshima

Kenichiro Matsuo

Daisuke Kimijima

Yutaka Ikeda

A liquid ejecting apparatus includes a liquid ejecting head including one of a first-flow path member and a second-flow path member, and a flow path structure body including another of the first-flow path member and the second-flow path member. The first-flow path member has a base portion and a first-flow path pipe protruding from the base portion in an insertion direction. The second-flow path member has a coupling surface having a first-opening portion that the first-flow path pipe is inserted and a first-guide portion disposed in a direction opposite to the insertion direction with respect to the coupling surface. The first-flow path pipe includes a first-insertion portion inserted into the first-opening portion and a first-guided portion that is guided by the first-guide portion before the first-insertion portion is inserted into the first-opening portion. The first-guided portion is disposed between the first-insertion portion and the base portion.

Liquid ejecting apparatus

A liquid ejecting apparatus includes a liquid ejecting head that has an ejection surface including a first nozzle row configured to eject a first ink and a second nozzle row configured to eject a second ink. The liquid ejecting head is configured to be held in a first posture in which the ejection surface is inclined with respect to a horizontal plane. A dynamic surface tension of the second ink is higher than a dynamic surface tension of the first ink. In the first posture, the first nozzle row is positioned above the second nozzle row with respect to a gravity direction.

Liquid ejecting apparatus and liquid ejecting head

A liquid ejecting head configured to eject a liquid in a first direction includes: head units arranged side by side in a second direction orthogonal to the first direction and a flow channel member having a first supply flow channel through which the liquid is supplied to the head units, a first collection flow channel through which the liquid is collected from the head units, a first inlet portion through which the liquid is let into the first supply flow channel from the outside, and a first outlet portion through which the liquid is let out to the outside from the first collection flow channel. The first inlet portion and the first outlet portion are disposed near the center of the flow channel member in the second direction.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting apparatus executing a print operation of ejecting liquid to a medium when a print job is input includes nozzles configured to eject liquid, piezoelectric elements corresponding to the nozzles, and driving circuits configured to supply a micro vibration pulse for generating micro vibration in the liquid included in the nozzles without ejection of the liquid from the nozzles to the piezoelectric elements. Strength of the micro vibration generated by the micro vibration pulse varies based on the print job.

Liquid ejecting apparatus and method for controlling the same

A liquid ejecting apparatus according to an aspect of the present disclosure has a nozzle configured to eject a liquid, a pressure chamber communicating with the nozzle, a piezoelectric element that varying pressure in the pressure chamber, an endless transport belt transporting a medium, an electrifying section electrifying the transport belt, and a driving circuit that supplying, to the piezoelectric element, a micro-vibration pulse that generates micro-vibration in the liquid in the pressure chamber without causing the liquid to be ejected from the nozzle. The micro-vibration pulse is varied according to first data related to the state of a meniscus in the nozzle in a first state in which the nozzle and the transport belt electrified by the electrifying section face each other.

Ejecting apparatus and method of controlling liquid ejecting apparatus

A method of manufacturing a semiconductor device and a semiconductor device that is manufactured by the method. In the method of manufacturing a semiconductor device, a releasing sheet is disposed in close contact with a hole of an aluminum plate having the recessed hole, and a skeleton structure of a semiconductor device is put into the recessed hole. Then, liquid epoxy resin is poured into the recessed hole. After hardening, the epoxy resin bodyincluding the skeleton structure is taken out from the recessed hole to complete manufacturing the semiconductor device. Using a simple molding jig including the aluminum plate, and covering the skeleton structure with the epoxy resin body, a highly reliable semiconductor device with a case-less construction can be manufactured.

Semiconductor device and method of manufacturing the same

Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.

Manufacturing and evaluation method of a semiconductor device

A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

Pressure detecting apparatus

A photosensitive body comprises a conductive substrate; a photosensitive layer on the conductive substrate, the photosensitive layer includes a charge transport compound wherein the charge transport compound is described by a general formula (I): ##STR1## wherein A is a phenyl or naphthyl group; each of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is a hydrogen atom, a halogen atom, an alkyl group with or without substitution, an alkoxy group, an alkylamino group, a nitro group, a cyano group, an aryl group with or without substitution, or a heterocyclic group with or without substitution; and each of R.sup.5 and R.sup.6 is a cyano group or an alkoxycarbonyl group.

Electrophotographic photosensitive body containing butadiene-derivative

A photoconductor for internal irradiation electrophotography includes a substrate which is hollow, cylindrical, and transparent, and which is composed of a synthetic resin; an electroconductive layer which is provided on an outer surface of the substrate and which has a surface resistance of no higher than 2.times.10.sup.6 .OMEGA./square; a photosensitive layer which is composed of organic material, which is provided on the electroconductive layer, and which is dip coated from a liquid including an organic solvent; and a protective layer which is provided on an inner surface of the substrate, wherein the protective layer and the electroconductive layer are resistant to the organic solvent of the liquid for dip coating.

Growing community of inventors

Matsumoto, Japan

Kei Yamaguchi