Nitto-denko Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kei Nakamura

Yasushi Inoue

Megumu Nagasawa

Takuji Okeyui

Satoshi Tanigawa

Hiroshi Yamazaki

Yusuke Shimizu

Hiroyuki Yamada

Masakazu Sugimoto

Masayuki Hodono

Mitsuru Honjo

Yukihiro Yoshimine

Shingo Okamoto

Yasuto Ishimaru

Daisuke Yamauchi

Shinya Ota

Emiko Tani

Hitoshi Ishizaka

Ryusuke Naito

Mineyoshi Hasegawa

Masayuki Kaneto

Yoshihiro Toyoda

Isao Hasegawa

Yousuke Ishii

Takatoshi Sakakura

Makoto Tsunekawa

Takeshi Yamato

Masaharu Takenaka

Shinya Oota

A solar battery module is provided with a plurality of solar cells, a wiring material for connecting adjacent solar cells in the longitudinal directors to form strings, and a reflective body disposed on the rear-surface side of the solar cells, said body reflecting at least some incident light toward the solar cells. In the solar battery module, the strings are multiply disposed in the horizontal direction to constitute string groups, intervals Dbetween adjacent strings being formed wider in the longitudinal center section of the string groups than in the longitudinal end sections.

Solar battery module

A solar cell module manufacturing method includes: preparing a front-side transparent protective member and a back-side protective sheet member, the front-side transparent protective member including a first principal surface and a second principal surface, a surface area of at least the first principal surface being larger than a projected area of the first principal surface, the back-side protective sheet member including a third principal surface and a fourth principal surface; and disposing a solar cell between the second principal surface of the front-side transparent protective member and the third principal surface of the back-side protective sheet member, and sealing the solar cell with a bonding layer therebetween. A breaking elongation of the back-side protective sheet member is 300% or more.

Solar cell module manufacturing method

A solar cell module includes a solar cell string including solar cells disposed in an arrangement direction and at least two wiring members provided to extend along the arrangement direction in order to electrically connect the solar cells. The at least two wiring members include a first wiring member disposed at a first position where a distance between the solar cells adjacent to each other is short and a second wiring member disposed at a second position where the distance between the solar cells adjacent to each other is long. The respective first and second wiring members include bent portions between the solar cells. Between edge portions of the solar cells facing each other, the first wiring member has a slope whose maximum value is larger than the maximum value of a slope of the second wiring member.

Solar cell module

An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

Optical sensor module

A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.

Wired circuit board

A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 &#x3bc;m, and the distance between the adjacent wiring traces is set to not less than 8 &#x3bc;m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 &#x3a9; and not more than 50 &#x3a9;.

Printed circuit board and magnetic head driving device including the same

An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of not less than 200&#xb0; C. and not more than 300&#xb0; C. for approximately an hour to be thermally treated. Then, the thin copper film and the thin metal film are removed by chemical etching except the portions under the conductor patterns.

Method for manufacturing printed circuit board

A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45&#xb0;. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

Printed circuit board

A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

Multilayer flexible wiring circuit board and its manufacturing method

A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

Method for producing multilayer wiring circuit board

A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.

Circuit board for mounting bare chip

A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer made of an organic high molecular weight resin and a circuit provided on each side of the insulating layer the circuits on both sides being electrically connected through via-holes filled with a conductor made of solder having a metal powder dispersed therein.

Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board

A plurality of double-sided circuit boards in which a circuit is provided on either side of an insulating layer comprising an organic high molecular resin with an alloy foil as a basic substance, and two circuits are electrically connected by a via with a soldered conductor a filled therein are laminated via an adhesive layer The adhesive layer has a bore opened at a predetermined position of a portion in direct contact with the circuits of two double-sided circuit boards A bore portion is provided with a soldered conductor The circuits of the two double-sided circuit boards are electrically connected by the soldered conductor

Multi-layer wiring board and method for manufacturing the same

A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

Growing community of inventors

Osaka, Japan

Kei Nakamura