Oki Electric Industry Co., Ltd.

Kei Nakakuki

Satoshi Itaya

Yoshiro Takahashi

Kayo Hamano

An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed circuit board, a metal cover for covering the plurality of electronic components remaining a space or a cavity between the top surface of the printed circuit board and the inner surface of the metal cover having a flange surrounding the outskirts of the metal cover to be adhered to the top surface of the multi-layered printed circuit board, and a heat conductive member packed between the bottom surface of the electronic components, wherein the multi-layered printed circuit board has at least one through-hole vertically penetrating the multi-layered printed circuit board at a location corresponding to the flange and is lined by a metal film, and the multi-layered printed circuit board has a heat conductive layer arranged along the rear surface of the multi-layered printed circuit board, the heat conductive layer being connected to a metal lining of the through-hole.

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Tokyo, Japan

Kei Nakakuki