Shin-etsu Chemical Co., Ltd.

Kei Miyoshi

Masatoshi Arai

Hironao Fujiki

Takafumi Sakamoto

Kunihiro Yamada

Naoki Yamakawa

Nobuaki Matsumoto

Eiichi Tabei

Yoshifumi Inoue

Tomoyuki Goto

Ikuo Sakurai

Hironobu Muramatsu

Shinichi Sato

Yoshio Inoue

Tsuneo Kimura

Toshiyuki Ozai

Kenichi Isobe

Akihiro Endo

Kouichi Tanaka

Yoshinori Ogawa

Hiroaki Kizaki

Yoshifumi Harada

Tokuo Sato

A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25&#xb0; C. of not more than 100 Pa&#xb7;s, and yielding a cured product upon heating at 150&#xb0; C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 &#x3bc;m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 &#x3bc;m but less than 10 &#x3bc;m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

Silicone adhesive for semiconductor element

Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

Heat-conductive silicone composition and cured product thereof

Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25&#xb0; C. of 10 to 10,000 mm/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

Heat conductive silicone grease compositions

A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa&#xb7;s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23&#xb0; C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

Silicone resin composition for die bonding

Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.

Silicone-sealed LED

A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360&#xb0; C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Heat dissipating silicone grease compositions

An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula:&#x2014;(RSiO)&#x2014;wherein, Ris an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of RSiOunits wherein, Ris a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiOunits, and/or RSiOunits wherein, Ris as defined above, in which at least two of all the Rgroups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.

Addition curable silicon resin composition for light emitting diode

Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula RSiZ(in which, Rrepresents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol % of all Rgroups are alkenyl groups, and from 10 to 80 mol % of all Rgroups are aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 mol % of all Z groups are oxygen atoms, and n is a number that satisfies 1=n&#x3c;2), in which from 5 to 50 mol % of all silicon atoms exist within structures represented by an average formula: &#x2014;SiR&#x2014;X&#x2014;(SiRO)SiR&#x2014;X&#x2014;SiRO&#x2014; (in which, Rrepresents a monovalent hydrocarbon group, provided that from 10 to 80 mol % of all Rgroups are aryl groups, X represents an oxygen atom or a bivalent hydrocarbon group, and l represents an integer of 3 or greater), (B) an organohydrogenpolysiloxane having at least 2 SiH groups within each molecule, and (C) an addition reaction catalyst. The composition is capable of producing a cured product with a high degree of hardness and excellent crack resistance. The composition is useful as a sealing material and an adhesive.

Addition curing silicone composition capable of producing a cured product with excellent crack resistance

LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.

LED devices and silicone resin composition therefor

A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPa&#xb7;s at 25&#xb0; C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPa&#xb7;s at 25&#xb0; C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.

Heat conductive silicone rubber composition and molded article

Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.

Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device

In a silicone rubber composition comprising an organopolysiloxane as a base polymer, 0.1-50 parts by weight of a modified silicone fluid having a melting point of up to 100&deg; C. and a refractive index difference of 0.01-0.05 from the base polymer is blended per 100 parts by weight of the composition. The composition is cast and cured to form a mother mold which maintains parting properties over a long term.

Mother mold-forming silicone rubber composition and mother mold

A hydrosilylation catalyst is provided wherein a platinum catalyst is enclosed in a heat-fusible compound having a melting point of 40-200.degree. C. and containing an aliphatic unsaturated bond, carbonyl, carboxyl or thioether radical in a molecule. The catalyst is blended in organo-polysiloxane to form a silicone composition having both shelf stability and fast-curing capability.

Hydrosilylation catalysts and silicone compositions using the same

More than about 9/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst enclosed in a compound having a melting or softening point of 40-200.degree. C., less than about 1/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst, and an addition reaction retarder are blended in an organopolysiloxane composition comprising an organopolysiloxane containing alkenyl or hydroxyl radicals and an organohydrogenpolysiloxane. The composition has improved shelf stability, an increased pot life, good curing capability, and fast curing upon heating.

Organopolysiloxane compositions

A room temperature curable mildew resistant organopolysiloxane composition comprises (A) a hydroxyl or hydrolyzable group-containing organopolysiloxane, (B) a hydrolyzable organosilane such as methyltrimethoxysilane, methyltris(methylethylketoxime silane) or vinyltris(methylethylketoxime silane), a partially hydrolyzed product thereof or a mixture of the hydrolyzable organosilane with the partially hydrolyzed product thereof; and (C) a triazolyl group-containing compound such as 2-(4-chlorophenyl)ethyl-.alpha.-(1,1-dimethylethyl)-1H-1,2,4-triazole-1-yl -ethanol. Preferably, the component (B) does not contain aliphatic unsaturation in the molecule, and in this case, the component (B) free of aliphatic unsaturation is used in combination with (B') a hydrolyzable silane such as tetrakis(dimethylketoxime)silane, a partially hydrolyzed product thereof or a mixture of the hydrolyzable silane and the partially hydrolyzed product thereof.

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Annaka, Japan

Kei Miyoshi