Hitachi Chemical Company, Ltd.

Kei Kasuya

Hiroshi Matsutani

Shigeru Nobe

Akitoshi Tanimoto

Yu Aoki

Shingo Tahara

Daisuke Ryuzaki

Takumi Ueno

Shigeki Katogi

Kouichi Abe

Tetsushi Maruyama

Yousuke Aoki

Kyouko Kojima

Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein Rrepresents a hydrogen atom or a methyl group; and Rrepresents a hydroxyalkyl group having 2 to 20 carbon atoms.

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein Rrepresents a hydrogen atom or a hydrocarbon group; Rrepresents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Positive photosensitive resin composition, method of creating resist pattern, and electronic component

The present invention provides a photosensitive resin composition comprising a component (a): a siloxane resin obtained by hydrolyzing and condensing a silane compound comprising a compound represented by the general formula (1) shown below, a component (b): a solvent dissolving the component (a) therein, and a component (c): a quinonediazide sulfonic acid ester. 

Radiation-sensitive composition, method of forming silica-based coating film, silica-based coating film, apparatus and member having silica-based coating film and photosensitizing agent for insulating film

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Hitachi, Japan

Kei Kasuya