Kei Itagaki

Yoshinobu Ozaki

Tatsuya Yahata

Shintaro Hashimoto

Kohei Taniguchi

Tsuyoshi Tazawa

Ayako Taira

A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface forming a holding surface for holding the adhesive-attached chip.

Method of manufacturing semiconductor device and collet

A support piece formation laminate film according to the present disclosure includes a base material film, a pressure-sensitive adhesive layer, and a support piece formation film, in this order, in which the support piece formation film has a multi-layer structure including at least a metal layer. The support piece formation laminate film is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip.

Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor

One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

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Tokyo, Japan

Kei Itagaki