Sumitomo Osaka Cement Co., Ltd.

Tokyo Electron Limited

Kei Furuuchi

Shinichi Maeta

Mamoru Kosakai

Yoshiaki Moriya

Yukio Miura

Takashi Satou

Takashi Sato

Takeshi Watanabe

Tomoyuki Takahashi

Yasuharu Sasaki

Kaoru Oohashi

Kazunori Ishimura

Tadashi Aoto

Ryuuji Hayahara

An electrostatic chuck apparatus is disclosed which can be prevented from being damaged or fractured when the temperature abruptly increases or decreases when plasma is irradiated on a plate-like specimen, the heater is heated, or the like, and can also prevent corrosion when a corrosive gas or plasma is provided. The electrostatic chuck apparatus has an electrostatic chuck portionhaving a mounting platemade of a corrosion-resistant ceramic, a supporting platewhich is integrated with the mounting plateso as to support the mounting plateand is made of an insulating ceramic having a larger thermal conductivity than the thermal conductivity of the corrosion-resistant ceramic, and an internal electrode for electrostatic adsorptionprovided between the mounting plateand the supporting plate; and a temperature-controlling base portionwhich adjusts the electrostatic chuck portionto a desired temperature.

Electrostatic chuck apparatus

An electrostatic chuck device includes an electrostatic chuck part that has an upper surface as a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and a cooling base part that cools the electrostatic chuck part. The electrostatic chuck part and the cooling base part are integrally adhered to each other via an adhesive layer. An insulator having a double pipe structure including an insulator and an insulator provided coaxially with an outer peripheral portion of the insulator is provided in a cooling gas hole, formed in the electrostatic chuck part and the cooling base part, so as to cover an exposed surface of the adhesive layer on the cooling gas hole side.

Electrostatic chuck device

An electrostatic chuck apparatus including:

An electrostatic chuck device () according to the invention includes an electrostatic chuck section () that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section () that cools the electrostatic chuck section (), wherein a heating member () is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section () through a first adhesive material layer (), and the electrostatic chuck section () and the heating member () are bonded to and integrated with the cooling plate section () through an acrylic adhesive layer () having flexibility and insulation properties.

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Tokyo, Japan

Kei Furuuchi