Au Optronics Corporation

Keh-Long Hwu

Yung-Chih Chen

Chun-Hsin Liu

Tsung-Ying Ke

Wan-Tsang Wang

Li-Chih Hsu

Chih-Jen Hu

Ya-Ting Hsu

Po-Yang Lin

Chia-Hsun Tu

Seok-Lyul Lee

Chih-Cheng Chan

Kuo-Feng Kao

Wan-Lin Chen

Zeng-De Chen

Shih-Hsing Hung

Wei-Chia Fang

Cheng-Chung Chen

Tsung-Chin Cheng

Weng-Bing Chou

Yung-Hsiang Lan

Chih-Ling Hsueh

Chen-Shuo Huang

Pin-Fan Wang

Yen-Huei Lai

Cheng-Liang Wang

Chih-Yu Yu

Ping-Sheng Kuo

Ji-Feng Chen

Chun-Chung Wu

A display panel including a first array substrate, a first pad, and a second pad is provided. The first array substrate includes a first substrate, a first active element, a first display element, and a second display element. The first active element is disposed on the top surface of the first substrate. The first display element and the second display element are disposed on the top surface of the first substrate. The first display element is electrically connected to the first active element. The first pad and the second pad are disposed on the bottom surface of the first substrate. The first active element is electrically connected to the first pad. Each of the first pad and the second pad includes an embedded part and a protruded part. The embedded part is located in the first substrate. The protruded part is protruded from the bottom surface of the first substrate.

Manufacturing method of display panel having pad comprising embedded part and protruded part

A flexible display including a buffer layer, a plurality of pixel structures, a plurality of first pads, a plurality of first conductive through holes, a flexible circuit board and an adhesive layer is provided. The pixel structures are disposed on a first surface of the buffer layer. The first pads are disposed on a second surface of the buffer layer. The first conductive through holes are embedded in the buffer layer. The first pads are respectively electrically connected to the pixel structures through the first conductive through holes. The adhesive layer is disposed between the second surface of the buffer layer and the flexible circuit board. An orthogonal projection of the adhesive layer on the buffer layer overlaps an orthogonal projection of the pixel structures on the buffer layer. The first pads are electrically connected to first signal lines of the flexible circuit board.

Flexible display

The disclosure provides a display panel including first pixel structures, second pixel structures, first signal lines, second signal lines, a first driving circuit, and a second driving circuit. The first signal lines and the first pixel structures are disposed in a first display area and electrically connected. The second signal lines and the second pixel structures are disposed in a second display area and electrically connected. The first display area and the second display area are arranged in a first direction. The first signal lines and the second signal lines are arranged in a second direction. The first direction and the second direction are perpendicular. The first signal lines and the second signal lines are structurally separated. The first drive circuit is electrically connected to the first signal lines. The second driving circuit is electrically independent from the first driving circuit and electrically connected to the second signal lines.

Display panel

A display panel including a first array substrate, a first pad, and a second pad is provided. The first array substrate includes a first substrate, a first active element, a first display element, and a second display element. The first substrate has a top surface and a bottom surface disposed opposite to each other. The first active element is disposed on the top surface of the first substrate. The first display element is disposed on the top surface of the first substrate and is electrically connected to the first active element. The second display element is disposed on the top surface of the first substrate and is disposed separately from the first display element. The first pad and the second pad are disposed on the bottom surface of the first substrate, wherein the first active element is electrically connected to the first pad, each of the first pad and the second pad includes an embedded part and a protruded part, the embedded part is located in the first substrate, and the protruded part is protruded from the bottom surface of the first substrate.

Display panel having pad disposed on bottom surface of substrate and manufacturing method thereof

A display device includes a pixel circuit substrate, a plurality of light emitting devices, a driver circuit substrate, a plurality of connection terminals, and an electrically conductive adhesion layer. The light emitting devices are electrically connected to the pixel circuit substrate. The driver circuit substrate is disposed on a back side of the pixel circuit substrate. The connection terminals electrically connect the driver circuit substrate to the pixel circuit substrate. The electrically conductive adhesion layer is disposed between the pixel circuit substrate and the driver circuit substrate.

Display device

A display device including a first substrate, pixel structures, a second substrate, first signal lines, and second signal lines is provided. The pixel structures are disposed on a first surface of the first substrate. Each of the pixel structures includes a switch element and a pixel electrode. The switch element has a first terminal, a second terminal, and a control terminal. The pixel electrode is electrically connected to the second terminal of the switch element. The second substrate is disposed under a second surface of the first substrate. The first signal lines and the second signal lines are disposed on the second substrate. The first terminals and the control terminals of the switch elements of the pixel structures are respectively electrically connected to the first signal lines and the second signal lines, wherein the first signal lines are substantially parallel to the second signal lines.

A manufacturing method of a light-emitting device including the following steps is provided. A test trace and a first signal trace are formed on a first substrate. A light-emitting element electrically connected to the test trace and the first signal trace is formed. A test procedure is performed on the light-emitting element via the test trace and the first signal trace. An encapsulation layer is formed on the first substrate to cover the light-emitting element. The test trace is removed, and then a driving unit electrically connected to light-emitting element is formed.

Manufacturing method of light-emitting device

A foldable display device includes a shell. The shell has an expanding state and a folding state. A first direction and a second direction are defined to be orthogonal. When the shell is at the expanding state, the shell has a first length Lalong the first direction and a second length Lalong the second direction. The ratio of the first length Lto the second length Lis between 1.3 and 2. When the shell is at the folding state, the shell has a third length Lalong the second direction and a fourth length Lalong the first direction. The ratio of the third length Lto the fourth length Lis also between 1.3 and 2.

Foldable display device

A foldable display device includes a shell. The shell has an expanding state and a folding state. A first direction and a second direction are defined to be orthogonal. When the shell is at the expanding state, the shell has a first length L1 along the first direction and a second length L2 along the second direction. The ratio of the first length L1 to the second length L2 is between 1.3 and 2. When the shell is at the folding state, the shell has a third length L3 along the second direction and a fourth length L4 along the first direction. The ratio of the third length L3 to the fourth length L4 is also between 1.3 and 2.

A flexible display has a display layer, a thin-film transistor (TFT) layer and a flexible substrate. The display layer has a plurality of display units. The TFT layer has a plurality of pixel control circuits and a plurality of sensing circuits. The pixel control circuits are configured to control operations of the plurality of display units. Each of the sensing circuits is configured to generate a deformation signal according to deformation of the flexible display. The flexible substrate and the TFT layer are stacked.

A method of fabricating a flexible substrate structure includes the following steps. A supporting carrier is provided, and a release layer is formed on the supporting carrier, where the release layer includes a photo-sensitive adhesive layer. A local modification process is performed to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer. The local modification process includes performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer.

Method of fabricating flexible substrate structure

An electrophoretic display system includes an electrophoretic display panel, a timing controller, a data driver, and a gate driver. The data driver includes a first serial-to-parallel converter and a data converter. The first serial-to-parallel converter receives a plurality of first series data and converts the first series data into a plurality of second series data. The quantity of the second series data is more than the quantity of the first series data. The data converter receives the second series data and is electrically connected to the electrophoretic display panel. Besides, the data converter converts the second series data into display voltages, and the quantity of the display voltages is more than the quantity of the second series data. The gate driver is electrically connected to the electrophoretic display panel and the timing controller and controlled by the timing controller to provide gate driving voltages to the electrophoretic display panel.

Electrophoretic display system

In a method of fabricating a flexible display panel, a rigid substrate is provided. A flexible substrate having a first surface and a second surface opposite to the first surface is provided. A plurality of releasing-regions are formed on the first surface, and bonding strength of an area outside the releasing-regions is greater than bonding strength of the releasing-regions. An adhesive layer is formed between the rigid substrate and the first surface of the flexible substrate. A plurality of display units are formed on the second surface, and each of the display units is located over one of the releasing-regions, respectively. The flexible substrate is patterned to obtain a plurality of flexible carriers, and each of the flexible carriers carries one of the display units, respectively. The flexible carriers and the adhesive layer are de-bonded.

Flexible display panel and method of fabricating the same

A display device and a manufacturing method thereof are provided. The display of the present invention includes a flexible substrate, a display layer, a protecting layer, an electronic unit, and a filling glue. The flexible substrate has a carrying surface. The display layer is disposed on the carrying surface and has a side edge. The protecting layer is disposed on the opposite side of the display layer corresponding to the carrying surface. The electronic unit is disposed on the carrying surface with a space formed between the electronic unit and the side edge of the display layer. The filling glue is filled in the space and connected with the side edge of the display layer, the electronic unit, and the carrying surface.

Display device with flexible substrate and manufacturing method thereof

A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer.

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Hsinchu County, Taiwan

Keh-Long Hwu