Rohinni, Inc.

Keenan Allison

Cody George Peterson

Sean Kupcow

Brian Miner

An apparatus for aligning and orienting a semiconductor die ('die') to be transferred to a substrate. The apparatus includes an alignment mechanism to align the die to be queued among a plurality of die; and an orientation mechanism to orient the die using magnetism to be positioned in a predetermined position prior to transfer to the substrate. The alignment mechanism further transports the die to be positioned at a feeding position for supply to a die transfer system.

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Coeur d'Alene, ID, United States of America

Keenan Allison