Seagate Technology Incorporated

Jp Morgan Chase Bank

Keefe Russell

Sandeepan Bhattacharya

James A Fisher

Paritosh Chandrakant Panchal

Manish Virmani

Richard August Budde

Gordon Merle Jones

Jon Karsten Klarqvist

Shri Hari Narayan

Pow Hing Yong

Richard L Segar

Daniel Hardy

Liu Xiong

Heng Tung Joseph Lau

Jennifer A Engebrit

Rich Lawrence Segar

An arm assembly for a disc drive. The arm assembly has a load arm for supporting a slider and has a lift tab with a ramp-engaging region for parking the load arm when not in use. This ramp-engaging region has an outer surface defined by a first radius and a second radius different than the first radius.

Arm assembly with lift tab

A head gimbal assembly includes a gimbal, a slider, and a polymer layer. The gimbal comprises a metal layer, and the metal layer of the gimbal defines a gimbal mounting portion for attachment to a metallic load beam and a gimbal tongue extending from the gimbal mounting portion. The slider comprises a ceramic material for carrying a transducing head, and at least a portion of the slider is secured to the gimbal tongue. The polymer layer is positioned adjacent to the gimbal and configured for limiting ceramic-to-metal and metal-to-metal contact.

Protective layer on gimbal for scratch mitigation

A head gimbal assembly for use with a load beam includes a gimbal, a slider for carrying a transducing head, and first and second tabs. The gimbal is configured to be supported by the load beam, and includes a gimbal tongue. At least a portion of the slider is secured to the gimbal tongue. The first tab extends from the gimbal tongue proximate a first corner of the slider. The second tab is spaced from the first tab and extends from the gimbal tongue proximate a second corner of the slider.

Slider-gimbal scratch mitigation

Head gimbal assemblies for data storage systems are provided. Some embodiments include a dielectric layer having a first and a second side. A first conductive layer is on the first dielectric layer. The first conductive layer includes a pad and a trace. A second conductive layer is on the second dielectric side. A via extends from the first dielectric layer side to the second dielectric layer side. The via electrically connects the first conductive layer to the second conductive layer.

Head gimbal assembly without bus traces for plating

The present invention includes an improved suspension assembly comprises a suspension including a load beam and a gimbal, a FOS having a polymer portion (or flex circuit) and a trace portion, wherein the FOS is connected to the suspension. The present invention further includes a slider that is electrically connected to a ground trace and the ground trace is further electrically connected to the suspension. The present invention also includes a plateau gimbal, which comprises of a portion of the ground trace positioned between the flex circuit and the slider thereby elevating the slider to the level of the bond pads on the FOS.

HGA plateau gimbal design

A disc drive has an improved electrical interconnect assembly mated to a suspension assembly for coupling one or more conductive paths leading from a read/write head to control circuitry located off the suspension assembly. The interconnect assembly has a portion that extends along an edge of the suspension assembly that is oriented towards the outer diameter of a disc on the disc drive. The suspension may be made of a laminate material and may include a trench formed in the suspension that is configured to mount a portion of the interconnect assembly. Positioning a portion of the interconnect assembly on the edge of the suspension towards the disc outer diameter and mounting another portion of the interconnect assembly in a trench formed in the suspension assembly reduces windage-induced vibrations of the suspension assembly and, consequently, the head.

Laminate load beam with trench arrangement having circuit housed therein

The present invention provides a system, method and apparatus for controlling the coverage of an adhesive bond area between a suspension and a flex circuit interconnect by etching an area of the suspension to create a bonding area. The etching process prevents bonding of the flex circuit interconnect to the suspension in a tail and a side region allowing movement between the flex circuit and suspension, wherein the movement dampens a first torsion resonance mode. Better control of the bonding area between the interconnect and the suspension using the &ldquo;adhesive down&rdquo; helps reduce the variation in the roll stiffness of the suspension thereby reducing the fly height variation.

Growing community of inventors

Robbinsdale, MN, United States of America

Keefe Russell