Advanced Micro Devices Corporation

Kee Hean Keok

Seah Sun Too

Tek Seng Tan

Kevin W Lim

Keng Sang Cha

Soon Tatt Ow Yong

Azlina N Nayan

Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.

Semiconductor chip package fixture

An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate that may be removably seated thereon. The surfaces of the plurality of pillars have a first footprint at least as large as a footprint of the substrates to be placed thereon. A plate is provided for applying a compressive force to an integrated circuit lid positioned on any of the substrates removably seated on the pillars.

LGA fixture for indium assembly process

Growing community of inventors

Pulau Penang, Mali

Kee Hean Keok