Littelfuse, Inc.

Kedar V Bhatawadekar

Martin G Pineda

Mario G Sepulveda

Yuriy Borisovich Matus

Anthony Vranicar

Dov Nitzan

Minh V Ngo

Dong Yu

Werner Johler

Jason Larson

A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.

Circuit protection device with PTC element and secondary fuse

A protection device may include a resistor, the resistor including a first end for coupling between a load and a second end for coupling to a DC source. The protection device may also include a capacitor having a first terminal coupled between the second end of the resistor and the DC source, and a second terminal coupled to ground, the capacitor further comprising a capacitor body, wherein the capacitor body comprises a ferroelectric material.

Protection device and system using negative capacitance component

A fuse suitable for arc quenching is disclosed. The fuse incorporates a high-resistive material or element placed in parallel relationship with the fusible element to mitigate, minimize and/or prevent arcing during an overcurrent condition. By incorporating a high-resistive material or element in parallel with a fusible element an alternate or second path for current flow during an overcurrent condition is provided. As such, during normal operating conditions, current travels through the fusible element. However, during an overcurrent condition, the resistance through the fusible element increases. Once the resistance through the fusible element is greater than the resistance through the high-resistive material or element, the current will bypass the fusible element and travel through the high-resistive material or element. In this manner, arcing through the fusible element during the overcurrent condition can be prevented or minimized.

Electrical circuit protection device with high resistive bypass material

A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source. A load terminal is in electrical communication with the first and second terminals of the second portion and is configured to be connected to a load.

Arc suppression connector

A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3&#xb7;mm/m2&#xb7;atm&#xb7;day.

Method for manufacturing a surface mount device

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3&#xb7;mm/m2&#xb7;atm&#xb7;day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

Growing community of inventors

Santa Clara, CA, United States of America

Kedar V Bhatawadekar