Zhongshan Weiqiang Technology Co., Ltd.

Kechin Lee

Hongchieh Chen

The present invention relates to a high-power LED lamp. The lamp includes an LED module, an inner heat sink disposing air passages along an axial direction thereof, a heat pipe assembly including multiple U-shaped heat pipes, and an outer heat sink. Middle sections of the heat pipes form a smooth surface on which the LED module is attached. Straight sections of the heat pipes are coiled around the inner heat sink. The smooth surface is located at an end of the inner heat sink not to block the air passages of the inner heat sink. An annular vapor chamber is packaged a grid-shaped configuration of the heat pipes and attached to each heat pipe. The invention achieves fast heat conduction and dissipates the heat via the inner and outer heat sinks.

LED lighting system and high-power LED lamp

The present invention discloses an LED packaging structure, which comprises a metal housing having a cavity and two open ends, a sintered two-phase-flow heat transfer device having a flat top mounting plane, a lens disposed in the first open end, at least one LED chip mounted in the cavity of the metal housing and on the mounting plane of the two-phase-flow heat transfer device; the LED chip is connected with an electrical connection device, and wherein the sintered two-phase-flow, electrical connection device and LED chip are fixed together through a fixing base. Using a sintered two-phase-flow heat transfer device for heat dissipation, the heat generated by the LED could be expelled in time for dealing with long-term continual work, and thus the LED chip could have a longer service life. In addition, the lens used in the present invention could improve the luminescent efficiency.

Growing community of inventors

Zhongshan, China

Kechin Lee