Infineon Technologies Ag

Kean Ming Koe

Ke Yan Tean

Ivan Nikitin

Thomas Stoek

Sanjay Kumar Murugan

Thai Kee Gan

Edmund Sales Cabatbat

Michael Niendorf

Angel Enverga

Oliver Markus Kreiter

Elvis Keli

Mei Fen Hiew

Ludwig Busch

Tian See Hoe

Bernhard Stiller

A semiconductor package includes a die pad, a semiconductor die mounted on the die pad and comprising a first terminal facing away from the die pad and a second terminal facing and electrically connected to the die pad, an interconnect clip electrically connected to the first terminal, an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interconnect clip, and a first opening in the encapsulant body that exposes a surface of the interconnect clip, the encapsulant body comprises a lower surface, an upper surface opposite from the lower surface, and a first outer edge side extending between the lower surface and the upper surface, and the first opening is laterally offset from the first outer edge side.

High voltage semiconductor package with pin fit leads

A semiconductor module includes: a dual-gauge leadframe having thicker and thinner parts, part of the thinner part forming a high voltage lead; a semiconductor die attached to the thicker part; and a molding compound (MC) encapsulating the die. The thicker leadframe part is disposed at a bottom side of the MC. A side face of the MC has a stepped region between the high voltage lead and thicker leadframe part. A first generally vertical part of the stepped region extends from the high voltage lead to the generally horizontal part, a generally horizontal part of the stepped region extends to the second generally vertical part, and a second generally vertical part of the stepped region extends to the bottom side of the MC. A linear dimension of the generally horizontal part as measured from the first generally vertical part to the second generally vertical part is at least 4.5 mm.

Molded semiconductor module having a mold step for increasing creepage distance

Growing community of inventors

Penang, Malaysia

Kean Ming Koe