Lg Innotek Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Keal Doo Moon

Sung Joo Oh

Dong Yong Lee

Gyu Hyeong Bak

Sang Jun Lee

Min Seok Kang

Eun Yeob Kang

Ellen Park

One embodiment discloses an electronic device including a first acquisition unit which outputs first motion information about a detection target in a first detection region, a second acquisition unit which outputs second motion information about the detection target in a second detection region, and a control unit which executes an instruction according to the first motion information and the second motion information, wherein the first detection region and the second detection overlap at least partially.

Electronic device

One embodiment relates to a light emitting device package having improved luminous flux, and a light emitting device package, according to one embodiment of the present invention, comprises: a light emitting device having an electrode pad arranged at a lower surface thereof; a wavelength conversion layer for covering four lateral surfaces of the light emitting device; a first reflective pattern for covering an upper surface of the light emitting device and three lateral surfaces of the light emitting device so as to expose the wavelength conversion layer of the one remaining lateral surface, which is a light emitting surface of the light emitting device; and a second reflective pattern arranged between the first reflective pattern and the upper surface of the light emitting device.

Light emitting device package and lighting system comprising same

An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.

Light-emitting device package

Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.

Light emitting device package

Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof.

Growing community of inventors

Seoul, South Korea

Keal Doo Moon