Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Cummins Inc.

Hon Hai Precision Industry Co., Ltd.

Tsinghua University

Lenovo (beijing) Limited

Tula Technology, Inc.

China Mobile Communications Group Co., Ltd.

China Mobile Communication Co.,ltd Research Institute

Reli Technologies LLC

Beijing Xiaomi Mobile Software Co., Ltd.

China Academy of Telecommunications Technology

Chinese Academy of Medical Sciences

Tianjin Chase Sun Pharmaceutical Co., Ltd

Cspc Zhongqi Pharmaceutical Technology Co., Ltd.

Ke Wang

Zhanfeng Cao

Yingwei Liu

Zhiwei Liang

Guangcai Yuan

Xue Dong

Liang Chen

Feng Qu

Jianguo Wang

Ce Ning

Jiaxiang Zhang

Shou-Shan Fan

Wei Liu

Minghua Xuan

Xin Li

Qi Qi

Haixu Li

Xin Zhang

Hao Chen

Dongni Liu

Xueming Pan

Jia-Ping Wang

Haoliang Zheng

Li Sun

Fei Wang

Wei Yang

Yang Yang

Shaohui Sun

Kuanjun Peng

Xiao Lin Zhang

Xin Gu

Zhijun Lv

Haifeng Hu

Peng Xu

Song Liu

Yingmin Wang

Zhengliang Li

Hehe Hu

Kun Zhao

Yi Zheng

Fangzhen Zhang

Feng Guan

Ting Zeng

Huan Liu

Fengjuan Liu

Shiqiang Suo

Muxin Di

Guoqiang Wang

Yu Jiang

Wanpeng Teng

Hai Tang

Huijuan Wang

Shengguang Ban

Meng Zhao

Ling Li

Mingxing Wang

Nianqi Yao

Junwei Yan

Guocai Zhang

Hsuanwei Mai

Yan Qu

Renquan Gu

Qian Wu

Xiaoxin Song

Jian Yang

Xinhong Lu

Tianmin Zhou

Jintao Peng

Song Wu

Jie Huang

Dapeng Xue

Meng Yan

Xuan Liang

Lubin Shi

Xiaoyan Zhu

Jiayu He

Yang Lv

Xuan Feng

Zhaohui Qiang

Xiaoguang Chen

Xue Chen

Timothy Shipp

Bin Qin

Qingxun Zhang

Ming Ji

Yongbin Xie

Shuang Liang

Feifei Li

Yongfei Li

Shulei Li

Liping Li

Weiwei Chu

Zhiqiang Feng

Fangfang Lai

Nina Xue

Da-Tao Wang

Guanhua Du

Mei Gao

Yetao Huang

Chuan Zhou

A system includes an internal combustion engine including a valve train comprising one or more intake valves operable in a Miller cycle and one or more exhaust valves. An electric turbo motor is electronically controllable to boost an output from a lower pressure turbocharger to a higher pressure turbocharger. An electronic control system configured to control the electric turbo motor in response to a transient condition to boost intake flow pressure to the internal combustion engine during the transient condition.

Air handling systems and controls for internal combustion engines operating with a miller cycle

An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

Array substrate and manufacturing method therefor, display panel, and backlight module

A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.

Circuit board, light-emitting substrate, backlight module, and display apparatus

Disclosed in the embodiments of the present disclosure are an information processing method and a related network device. The method comprises: the network device receiving a first message which is sent by an access and mobility management function (AMF) and is used for slice authentication, the first message comprising a first slice identification, a first slice user identification and a first card user identification; determining a first pseudo code corresponding to the first slice identification and a first address of an authentication server, and generating a second message comprising the first pseudo code, the first slice user identification and the first card user identification; and sending the second message to the authentication server on the basis of the first address.

Information processing method and related network device

A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.

Circuit board and method for manufacturing the same, functional backplate, backlight module and display apparatus

A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.

Display backplane and manufacturing method thereof and display device

A back plate and a manufacturing method thereof, a method for bonding a chip, and a display device are provided. The back plate includes: a base substrate; and, a plurality of conductive connecting tubes disposed on the base substrate, wherein one end of each of the conductive connecting tubes is connected to the base substrate, and a side wall of each of the conductive connecting tubes is provided with an opening penetrating the side wall. And, the method for bonding a chip includes: providing the back plate; inserting an electrode of the chip into a corresponding conductive connecting tube from an end of the conductive connecting tube away from the base substrate; and heating the conductive connecting tube and the chip, so that the electrode of the chip is electrically connected to the conductive connecting tube.

Back plate and manufacturing method thereof, method for bonding chip, and display device

A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

Substrate and method for manufacturing the same, and display panel

A display panel has a display region and a fan-out lead region, the fan-out lead region is located within the display region. The display panel comprises a base, a pixel circuit layer, a plurality of fan-out leads disposed between the base and the pixel circuit layer and located in the fan-out lead region, and an electrical field shielding pattern disposed between the pixel circuit layer and a film layer in which the plurality of fan-out leads are located. The pixel circuit layer includes a plurality of pixel circuits, at least one pixel circuit is located in the fan-out lead region. At least one fan-out lead is electrically connected to the pixel circuits. Orthographic projection of active layer patterns of transistors of the pixel circuit located in the fan-out lead region on the base are located within an orthographic projection of the electric field shielding pattern on the base.

Display panel and method for manufacturing a display panel having a tiled screen with a fan-out lead region

A display interface control method, a display interface control apparatus and a storage medium are provided in the present disclosure. The display interface control method includes determining a display parameter of a first window in a second display screen based on a first operation of the first window in a first display screen; and displaying the first window in the second display screen based on the display parameter of the first window in the second display screen.

Display interface control method and apparatus thereof, and storage medium

Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

Intermediate substrate and fabrication method of display panel

A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

Display panel, manufacturing method thereof, and display device

An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least includes a driving transistor; and the driving circuit layer includes a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.

Array substrate and display panel including electrically connected gates

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same. The method includes: providing and processing a transparent dielectric layer to obtain the transparent dielectric layer provided with a first connection via therein, with the transparent dielectric layer including a first surface and a second surface which are disposed oppositely; and integrating a passive device, which includes at least an inductor, on the transparent dielectric layer. The integrating a passive device on the transparent dielectric layer includes: forming a first sub-structure on the first surface of the transparent dielectric layer, forming a second sub-structure on the second surface of the transparent dielectric layer, and forming a first connection electrode in the first connection via; and the first sub-structure, the first connection electrode and the second sub-structure are connected to form a coil structure of the inductor.

Substrate integrated with passive device and method for manufacturing the same

Growing community of inventors

Beijing, China

Ke Wang