Intel Corporation

Ke W Wang

Xingjian Cai

Michael J Castillo

Yun Ji

Mike J Castillo

Xing Jian Cai

Neffody E Kraskoff

Mohammad Ibrahim Khan

Wei Z Gao

Qing-lun Chen

Techniques and mechanism to provide signal communication with vias variously extending in a substrate. In an embodiment, a first capacitor and a second capacitor are coupled in parallel with one another each between a first via and a second via, the first via to receive a first signal. Respective portions of the first signal are concurrently communicated from the first via to the second via with the first capacitor and the second capacitor, respectively. In another embodiment, the first signal is one signal of a differential signal pair further comprising a second signal which is received at a third via. Respective portions of the second signal are concurrently communicated from the third via to a fourth via with a third capacitor and a fourth capacitor, respectively. The third capacitor and the fourth capacitor are coupled in parallel with one another each between the third via and the fourth via.

Coupling structures for signal communication and method of making same

In some embodiments a differential communication channel compensates for electrostatic discharge capacitance of an electrostatic discharge component by increasing an impedance of the differential communication channel near the electrostatic discharge component. Other embodiments are described and claimed.

Compensating for an electrostatic discharge capacitance load

A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Circuit board including hybrid via structures

An electrical connector and connection system are disclosed having an array of conductive coaxial pairs. Each pair consists of a cylindrical electrical conductor surrounded by a tubular electrically conductive shield with a dielectric insulator disposed there-between. A rigid connector housing contains the coaxial pairs in a fixed spaced parallel relationship. The housing has first and second interfaces relatively disposed at a right angle, and the conductors and shields each have connector pins extending from said interfaces for connection to a printed circuit board or a connector base. The coaxial pairs follow parallel curvilinear paths between the interfaces having two consecutive bends of forty-five angular degrees.

Right-angle coaxial connector

A modular chassis-based system may include a high speed backplane and multiple line cards. A connector connects the backplane to each line card for greater performance. The connector may include a stripline with a curved portion that transitions from the line cards to the backplane.

Growing community of inventors

Laveen, AZ, United States of America

Ke W Wang