Institute of Microelectronics

Ke Hor Seah

Mahadevan Krishna Iyer

Yong Kee Yeo

Edwin Lim

Weng Chiok Thong

The invention relates to a high frequency board-to-board connector for interconnecting electronic sub-assemblies. The high frequency board-to-board connector includes a row of conductive pins received in an insulative housing for connecting with receptacles of a design. Two discrete electronic sub-assemblies, for example PCBs, can be mechanically and electrically connected without the need for a gender male connector on one PCB and a corresponding gender female connector on the other PCB. A plurality of follower arms spaced apart along the grounding plate facilitates contact with a ground plane in the design to form a ground path. The ground path reduces electromagnetic coupling between any pair of conductive pins and consequentially lowering cross-talk noise. Furthermore, inductive parasitics of the conductive pins is reduced, further facilitating high frequency operations.

Growing community of inventors

Singapore, Singapore

Ke Hor Seah