Adv Antest Corporation

Kazuyuki Yamashita

Akihiko Ito

Yoshihito Kobayashi

Hiroto Nakamura

Yoshiyuki Masuo

Shin Nemoto

A handler is configured by, separably and connectably, a plurality of types of handling modules of different throughputs and a plurality of types of test modules of different numbers of simultaneous measurements and/or test temperatures. Based on the maximum number of measurable pins of the tester outputting a test pattern and examining a response pattern, the number of terminals of the DUTs, and the test time, the throughput of the handling module and the number of simultaneous measurements and/or test temperature of the test module are selected and combined.

Electronic device test apparatus and method of configuring electronic device test apparatus

An electronic device test apparatus includes a plurality of testers on which are mounted test heads that are connected to test outputters for outputting test signals to the electronic devices and for receiving response signals from the electronic devices. A loading transporter is provided at a frontmost stage of the testers that transports the electronic devices from a previous process conveyance medium to a test tray before loading the electronic devices into the testers. An unloading transporter is provided at a rearmost stage of the testers that unloads the electronic devices from the test tray to a later process conveyance medium corresponding to the response signals. A transporter is provided between the testers that transports the test tray from a previous process tester to a later process tester. The transporter includes a buffer that holds test trays to absorb a waiting time due to differences in processing capacities between test trays.

Electronic device test apparatus for successively testing electronic devices

An apparatus having a plurality of test units (), a loading transport unit () transporting a plurality of electronic devices from a customer tray (C) to a test tray (T) before being loaded in a test unit, and a classifying transport unit () transporting a plurality of electronic devices from a test tray while classifying them to customer trays in accordance with test results, the loading transport unit being provided at least at a frontmost stage of a plurality of test units, the classifying transport unit being provided at least at a rearmost stage of the plurality of test units, the test tray being successively conveyed from the frontmost stage to the rearmost stage of the plurality of test units in the state carrying electronic devices and returned from the rearmost stage test unit to the frontmost stage test unit.

An electronic device test apparatus for testing IC chips (IC) by pushing their input/output terminals (HB) against contact units of a test head, provided with an IC moving system () for picking up and moving an IC chip (IC) at the front surface where input/output terminals (HB) are led out, a first camera for capturing an image of the front surface of an IC chip (IC) before being picked up, a second camera for capturing an image of a back surface of an IC chip (IC) after being picked up, and an image processing system for calculating the position of input/output terminals (HB) of an IC chip (IC) picked up by the IC moving system () from the image information captured by the first camera and second camera and identifying the relative position of the IC chip (IC) picked up by the IC moving system () with respect to a contact unit based on the results of calculation, wherein the IC moving system () corrects the position of the IC chip based on the relative position of the input/output terminals (HB) of the IC chip (IC) with respect to the contact unit identified by the image processing system.

Electronic device test apparatus

An electronic device tray having a plurality of IC holders in which IC chips are held and having a shutter for opening and closing openings of the IC holders , the shutter being opened and closed by fluid pressure cylinders etc. provided at an IC tester. Further, a tray vertical carrier for conveying a tray holding IC chips in a substantially vertical direction, including a tray end holding member able to detachably hold an end of the lowermost level tray positioned at the lowermost level among stacked trays , a tray elevating member for conveying the lowermost level tray downward or upward, an actuator member for driving the tray end holding member so as to release the hold on the lowermost level tray and then hold the end of another tray next arriving at the lowermost level position when the lowermost level tray is in a state where it can be supported by the tray elevating member , and a tray horizontal carrier receiving the lowermost level tray when the tray elevating member descends and able to move in the substantially horizontal direction, the tray horizontal carrier being moved by a drive wire

Electronic device tray electronic device tray, transporting apparatus, and electronic device testing apparatus

A lead press mechanism is suitable for a self-drop type test handler for establishing an electrical contact between the lead terminals of IC devices to be tested and the contact terminals without deforming the lead terminals or adversely affecting the IC device testing. The lead press mechanism especially suitable for testing mold-framed IC devices. The lead press mechanism includes an IC device interface assembly for interfacing an IC device to be tested with an IC tester through IC socket terminals to provide test signals from the IC tester to the IC device and to send resulting output signals from the IC device to the IC tester; a lead press assembly having a guide mechanism including a contact rail for guiding the IC device in a vertical direction to a predetermined test position, a lead press for pressing lead terminals of the IC device against the IC socket terminals by protruding beyond the contact rail, and an elastic member which allows the lead press an additional movement against the force of the elastic member; and a distance mechanism for determining a distance between the IC device interface assembly and the lead press assembly when the when IC device interface assembly and the lead press assembly engage with each other.

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Tokyo, Japan

Kazuyuki Yamashita