Lintec Corporation

Arakawa Chemical Industries, Ltd.

Aloka Co., Ltd.

Kazuyuki Tamura

Takashi Akutsu

Shigeto Okuji

Yuki Eto

Tomohide Hukuzaki

Shigeo Kimura

Koichi Kawamura

Shizuo Ninomiya

Tomochika Tominaga

Keishi Fuse

Toshiaki Tamegai

The substrate for surface protective sheet of the present invention is a substrate for surface protective sheet including a support film and an antistatic layer provided on one face of the support film, wherein a stress relaxation rate of the substrate for surface protective sheet is 60% or more; the antistatic layer is one formed by curing an antistatic layer-forming composition containing a curing component and a metal filler; and the content of a metal filler is 55 mass % or more relative to the total mass of the curing component and the metal filler, and the curing component includes a urethane acrylate oligomer.

Substrate for surface protective sheet and surface protective sheet

A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

Surface protective sheet

The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Base film and pressure-sensitive adhesive sheet provided therewith

To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

The present invention relates to a back grinding sheet (BG sheet) () having an unevenness-absorbing layer () on a substrate (), in which the unevenness-absorbing layer is a layer formed of a film-forming composition containing (A) a urethane (meth)acrylate and (B) a polymerizable monomer except component (A) and the layer satisfies the following requirements (a) to (c): (a) a loss tangent at 70&#xb0; C. measured at a frequency of 1 Hz is 1.5 or more, (b) a relaxation rate 300 seconds after a square (1 cm&#xd7;1 cm) of the unevenness-absorbing layer is compressed at 25&#xb0; C. and a compressive load of 10 N is 30% or less, and (c) a storage elastic modulus at 25&#xb0; C. measured at a frequency of 1 Hz is 1.0 to 10.0 MPa. The BG sheet of the present invention has excellent absorptivity of uneven portions such as bumps in a semiconductor wafer and can suppress formation of gaps between bumps and the BG sheet and simultaneously suppress a phenomenon where the resin layer (unevenness-absorbing layer) of a BG sheet oozes from the edges of a roll when the BG sheet is wound up in the form of roll.

Back grinding sheet

A bone mineral content measuring apparatus for obtaining the bone mineral content of an object to be examined by irradiating X-rays onto the object and measuring the X-rays which have passed through the object. An X-ray generating device generates X-rays having a continuous spectrum. The X-rays generated pass through an X-ray filter before the irradiation of the object or after the transmission of the object. The X-ray filter is composed of a substance having an X-ray absorbing characteristic with the K-absorption edge at a predetermined energy value. The X-rays which have passed through the X-ray filter and the object are detected by the X-ray detector. A data analyzer inputs the detected X-ray detection data and analyzes the bone mineral content of the object on the basis of the X-ray absorbing characteristic of the X-ray filter.

Growing community of inventors

Tokyo, Japan

Kazuyuki Tamura