Sony Corporation

Shipley Company LLC

Kazuyuki Suda

Kazuo Murayama

Yasushi Takizawa

Toshio Asai

Yasuo Ohta

Kazunori Hibi

Akio Araki

A speaker apparatus has a frame to which a convex paper is attached. A bobbin with a voice coil is attached to the paper cone. A magnetic circuit is formed inside the frame. A damper suspending the bobbin is composed of a corrugation portion, which is positioned orthogonal to the bobbin in an inactivity of the speaker apparatus. The damper also includes a first leg portion extending forward along a vibration direction of the bobbin from an inner periphery end of the corrugation portion, and a second leg portion extending backward along the vibration direction of the bobbin from an outer periphery end of the corrugation portion. The first and second leg portions have substantially the same length.

Speaker apparatus

An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.

Electroless displacement gold plating solution and additive for use in preparing plating solution

Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Electroless gold plating bath and method

A changeover circuit in a tape recorder includes a recording and reproducing integrated circuit (IC) having a signal terminal and a bias terminal and arranged such that a DC potential at the signal terminal is set equal to that at the bias terminal, a changeover transistor whose collector and emitter are connected between a signal line connected to the signal terminal and the bias terminal, a controller for controlling the changeover transistor by supplying an output therefrom through a resistor to a base of the changeover transistor, and a bypass circuit connected between the bias terminal and a ground. The bypass state of the bypass circuit is controlled based on a control voltage from the controller.

Changeover circuit in tape recorder

An electronic apparatus includes at least a receiver having a synthesizer section for selecting a receiving frequency and providing an information signal corresponding to the selected receiving frequency, a microcomputer operating on a clock signal for controlling the synthesizer section, and a circuit responsive to the information signal for shifting the clock frequency when the selected receiving frequency is a frequency disturbed by a higher harmonic of the clock frequency, thereby to avoid disturbance of reception of the broadcast signal without requiring undue reduction of the clock frequency.

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Saitama, Japan

Kazuyuki Suda