Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kazuyuki Okano

Yo Hasegawa

Yasuhito Isozaki

Yoshihiro Bessho

Minehiro Itagaki

Satoru Yuhaku

Atsushi Motoya

Kazuhiro Miura

Yasuhiko Hakotani

Chiharu Hayashi

Takaari Uemoto

Makoto Horiuchi

Akira Nakanishi

Toshio Mori

Naoki Tagami

Munehiro Tabata

Seiichi Nakatani

Hideo Nagai

Masahiro Yamamoto

Yasuharu Ueno

Yoshinori Kakuno

Kenji Sugiura

Toru Okazaki

Tetsushi Tamura

Masahiro Miki

Nobuyoshi Takeuchi

Suzushi Kimura

Tatsuo Ogawa

Syunsuke Ono

Tsugihiro Matsuda

Koji Omura

Hiroki Ogawa

Shinji Saitou

Ikuko Aoki

Kenji Ueda

Hiroshi Hatase

Yurika Goto

You Hasegawa

Minako Akai

A light-emitting module includes a substrate, an LED chip arranged on a main surface of the substrate, a sealing member covering the LED chip on the main surface of the substrate and converting a wavelength of the light produced by the LED chip, and a heat transfer member thermally connecting the sides of the LED chip to the main surface of the substrate and dissipating heat produced by the LED chip to the substrate. The heat transfer member is made up of a silicone resin having particles dispersed therein, the particles being nanoparticles of ZrOand microparticles of MgO, which have higher thermal conductivity than the silicone resin.

Light-emitting module and lamp using same

A light-emitting device () includes a base (), a light-emitting element () placed on the base (), and a wavelength converting layer () that covers the light-emitting element (). The wavelength converting layer () includes a wavelength converting portion () that converts a wavelength of light from the light-emitting element (), and a light guide portion () made of a light-transmitting material, and the light guide portion () extends from a light-emitting element () side to a light extraction side of the wavelength converting layer (). Consequently, it is possible to provide a light-emitting device that can be miniaturized and reduced in thickness easily and can prevent a decrease in the light extraction efficiency.

Light-emitting device with a wavelength converting layer and method for manufacturing the same

The present invention provides a high pressure discharge lamp with a start-up assist member, a lamp unit, and a lamp system that reduce breakdown voltage and provide high design flexibility by reducing restriction on a position of an adjacent conductor. In a high pressure discharge lamp () of a lamp unit (), a dielectric member () is on the outer surface of a first sealing part (). The dielectric member () made of a titanium compound has relative permittivity higher than that of fused quartz. An upstream end of a metal wire () is connected to an external lead wire () projecting from a second sealing part (). A downstream end (A) is in contact with the dielectric member (). Upon lighting of the lamp, a corona discharge occurs at the point where the end () is in contact with the dielectric member () so that breakdown voltage is reduced.

High pressure discharge lamp with start-up assist member, lamp unit, lamp system, and projector

An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.

Mounting substrate and manufacturing method thereof, light-emitting module and illumination device

A glass composition including, in oxide-based mol %: (a) at least 30% and at most 50% PO, (b) at least 10% and at most 50% ZnO, (c) at least 0.1% and at most 10% AlO, (d) at least 0% and at most 50% LiO, (e) at least 0% and at most 50% NaO, (f) at least 0% and at most 50% KO, (g) at least 0% and at most 20% MgO, (h) at least 0% and at most 20% CaO, (i) at least 0% and at most 20% SrO, (j) at least 0% and at most 20% BaO, (k) at least 0% and at most 20% SnO, and (l) at least 0% and at most 5% BO, substantially not comprising ZrOand AgO, and (a)/(b), the ratio of (a) and (b), being at least 0.2 and at most 2.0.

Glass composition, light source device and illumination device

Light-emitting diode lamp

A paste for manufacturing ferrite is produced by dissolving the following materials: organometallic compound comprising a metal element Fe (A); organometallic compound comprising a metal element Me (Me herein denotes at least one element selected from the group consisting of Mn, Li, Mg, Ni, Zn, Y and Gd) (B); and at least one material selected from terpenoid carboxylic acid and resins containing the composition of the terpenoid carboxylic acid (C) in organic solvent (D). The paste permits providing a dense and homogeneous ferrite with a good property. Moreover, the use of such ferrite permits producing ferrite thin films. Furthermore, the ferrite with an excellent high-frequency property can be provided by coating and firing the paste of the present invention. The temperature properties of YIG thin film and Gd-substituted YIG thin film of the present invention are shown.

Paste for manufacturing ferrite and ferrite

A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.

Thixotropic conductive paste

Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.

Assembly formed from conductive paste and insulating paste

A capacitor which includes a dielectric layer, a metal electrode and a capacity adjusting electrode erodable by exposure to light energy, the capacity adjusting electrode being a film made of at least one selected from metallic oxides, metallic nitride and metallic boride.

Laser trimable capacitor

Process for preparing a metal sulfide thin film

Process for producing a base metal thin film and an electronic device

The present invention relates to a method for making a transparent conductive film, wherein a material for the film containing an organic indium compound and an organic tin compound is applied on a substrate, and made to thermally decompose, and thereafter, a heat treatment of the material is carried out in an atmosphere containing water vapor, thereby obtaining the transparent conductive film which shows low and stable electric resistance and is excellent in water resistance and chemical resistance, and is without undesirable cloudiness.

Method for making transparent conductive film

Process for forming thin film of metal sulfides

Growing community of inventors

Nara, Japan

Kazuyuki Okano