Mitsubishi Gas Chemical Company, Inc.

Mitsubishi Gas Company, Inc.

Kazuyuki Ohya

Norio Sayama

Takeshi Nobukuni

Kazuhiro Otsu

Mineaki Tanigaichi

Hideki Kobayashi

Morio Gaku

Hidenori Kimbara

Seiji Kita

Kazuo Noguchi

Michio Ohba

Shunichi Shinohara

Masaharu Kurata

Susumu Motoori

Masaki Fujihira

Takaaki Fukai

A method of press-working an inorganic substrate, which method uses a vacuum press machine having an air plunger type pressurization system and comprises bringing upper and lower heat plates which have been heated up to a predetermined temperature into contact with a combination set disposed between the upper and lower heat plates after or before the initiation of pressure reduction of a press atmosphere or under a reduced pressure and then carrying out a low pressure loading of from the initiation of pressurization to 0.05 Mpa over 10 seconds or longer and a press machine which is suitable for the above press-working method and which can set and control a low-pressure of 0.02 MPa or lower and comprises an air plunger that works as an air damper when the upper heat plate descends.

Method of press-working inorganic substrate and press machine therefor

Process for the production of electric part

Process for the production of composite ceramic printed wiring board

A method of supporting a semiconductor substrate according to the present invention can be applied to the step of processing the semiconductor substrate at a high temperature of 350&deg; C. or higher, and there is provided a process for the production of electronic parts, comprising the steps of forming semiconductor circuits on one surface (surface A) of a semiconductor substrate (SEC) having a thickness of at least 0.2 mm, supporting the semiconductor substrate on a supporting substrate (BP) by bonding (AS) of said surface A to the supporting substrate (BP), grinding and polishing the exposed other surface (surface B) of the semiconductor substrate (SEC) by a physical method, a chemical method or a method of combination of these methods, to decrease the thickness of the semiconductor substrate (SEC) to less than 0.2 mm, forming semiconductor circuits in the polished surface, to obtain an electronic-circuits-possessing semiconductor substrate (PSE), and peeling (PS) the electronic-circuits-possessing semiconductor substrate (PSE) off from the supporting substrate (BP), wherein the step of grinding and polishing the surface B or the step of forming electronic parts in the surface B includes the step of processing the surface B at a high temperature of at least 350&deg; C., and the bonding (AS) uses a heat-resistant thermoplastic (RF).

Process for the production of electronic parts

A method of preparing a high-heat-resistance resin composite ceramic that can be used at a high temperature of over 400&deg; C., the high-heat-resistance composite ceramic exhibiting remarkably high heat resistance, excellent in processability, durability against chemicals and durability against plasma, further, exhibiting &ldquo;outgassing&rdquo; to a lesser degree at a high temperature under high vacuum. The method comprises the steps of impregnating an inorganic continuously porous sintered body (I) having an open porosity of at least 0.5% with an organometallic compound (M), heat-treating the impregnated inorganic continuously porous sintered body (I) to decompose the organometallic compound (M) and thereby forming a metal compound which is a carbide, a nitride, an oxide or a composite oxide on an inner wall plane of each of open pores, and filling a heat-resistant silicone resin (R) in the open pores by impregnation under vacuum and thermally curing the heat-resistant silicone resin (R).

Method of the preparation of high-heat-resistance resin composite ceramic

A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-imprgnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Metal-foil-clad composite ceramic board and process for the production

A composite ceramic board having a low dielectric constant and a low heat expansion coefficient and being suitable for use as a heat-resistant material having a high dimensional accuracy and a low dielectric constant, which is formed of a sintered substrate (II) having a thickness of 0.2 to 10 mm and a thermosetting resin (R) which is integrated into the sintered substrate (II) by being impregnated into pores of the sintered substrate (II) under vacuum and cured, the sintered substrate (II) being a substrate obtained from an inorganic continuous porous sintered body (I) produced by sintering a spherical inorganic powder having an average particle diameter of 0.1 to 10 .mu.m in the presence of a sintering aid, the sintered inorganic powder substantially retaining the spherical forms, the inorganic continuously porous sintered body (I) having an average pore diameter of 0.1 to 10 .mu.m, a true porosity of 8 to 35% and a closed porosity of 2% or less.

Composite ceramic board and process for the productivity thereof

An aromatic hydrocarbon formaldehyde resin novolak, useful as a raw phenolic compound for producing a curing agent and an epoxy resin, an epoxy resin composition which contains a novolak type epoxy resin derived from the above novolak resin and an epoxy resin and is therefore excellent in heat resistance, adhesion and humidity resistance, and a process for the production of a phenolic resin, which comprises reacting an aromatic hydrocarbon formaldehyde resin, phenol and formaldehyde in a novolak-forming reaction in the presence of a catalyst to prepare an aromatic hydrocarbon formaldehyde resin novolak, and treating the reaction product with steam while maintaining the temperature of a reaction mixture at 120.degree. to 195.degree. C. to remove unreacted substances and to decompose high-molecular-weight polymers.

Process for the production of phenolic resin and epoxy resin composition

A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-impregnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

An asbestos-free high performance clutch facing which exhibits a less decrease in the friction coefficient as well as a less wearing during long-term repeated cycles of loading at high temperatures is disclosed. The clutch facing is a disk-shaped clutch facing produced by molding a composition for a friction material with heating and under pressure, the composition comprising:

Clutch facing

A process is provided for the production of a base board for printed wiring. The process involves the steps of wrapping a block inorganic continuous porous material with a cloth, impregnating the wrapped block inorganic continuous porous material with a thermosetting resin under reduced pressure, curing the thermosetting resin to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less, or the steps of impregnating a block inorganic continuous porous material with a thermosetting resin in an impregnation vessel under reduced pressure, taking the block inorganic continuous porous material impregnated from the impregnation vessel, substantially removing the thermosetting resin adhering to surfaces of the block inorganic continuous porous material before the thermosetting resin forms a gel, curing the remaining thermosetting resin under heat to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less.

Process for the production of base board for printed wiring

An asbestos-free friction material with improved water resistance which is used in automobiles, vehicles, and industrial machinery is disclosed. The friction material comprises a fibrous reinforcing substrate other than asbestos, a binder and a friction wear regulator, the fibrous reinforcing substrate partly containing a fibrillated pulp of an aromatic liquid crystal polyester resin.

Friction material

A thermal resistance resin dust obtained by a process which comprises

Thermal resistance resin dust for friction material

A friction material for a brake obtained by a process which comprises

Friction material for brake

An asbestos-free disc brake pad is provided by employing a cyanate ester-based resin composition as binder. The disc brake pad exhibits consistent braking properties over a wide range of operating temperatures and an improved service life. Also the serious pollution problem due to use of asbestos in the conventional brake pads is removed.

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Tokyo, Japan

Kazuyuki Ohya