Micron Technology Incorporated

Kazuyuki Morishige

Kenichi Watanabe

Kumiko Ishii

Toshiaki Tsukihashi

Moeha Shibuya

Tetsuya Arai

Mieko Kojima

Guangcan Chen

Disclosed herein is an apparatus that includes a first wiring layer including first and second conductive patterns extending in a second direction and coupled to source and drain regions, respectively, and a second wiring layer including third and fourth conductive patterns extending in the second direction and coupled to the first and second conductive patterns, respectively. The first conductive pattern has first and second sections arranged in the second direction, and the second conductive pattern has third and fourth sections arranged in the second direction. The first and fourth sections are arranged in a first direction, and the second and third sections are arranged in the first direction. The third conductive pattern covers the first section without covering the second section. The fourth conductive pattern covers the third section without covering the fourth section.

Semiconductor device having output buffer

Disclosed herein is an apparatus that includes: first and second wiring patterns extending in a first direction, first and second transistors arranged adjacent to each other, and third to sixth wiring patterns extending in a second direction. The third wiring pattern is connected between the first wiring pattern and one of source/drain regions of the first transistor, the fourth wiring pattern is connected between the second wiring pattern and other of source/drain regions of the first transistor, the fifth wiring pattern is connected to one of source/drain regions of the second transistor, the fifth wiring pattern overlapping with the first wiring pattern, the sixth wiring pattern is connected to other of source/drain regions of the second transistor, the sixth wiring pattern overlapping with the second wiring pattern. The third and fourth wiring patterns are greater in width in the first direction than the fifth and sixth wiring patterns.

Output buffer circuit with metal option

Embodiments of the disclosure are drawn to apparatuses and methods for drivers with reduced voltage noise. Clock signals may be provided to semiconductor devices, and may be distributed throughout the device. Driven are provided along signal paths within the device which may act as buffers for the clock signals. Each clock signal may be coupled to multiple driver circuits within the driver. Each of the multiple driver circuits may be coupled to a different pair of power supply voltage lines. The driver circuits may all have a similar delay to each other.

Apparatuses and methods for drivers with reduced noise

Embodiments of the disclosure are drawn to apparatuses and methods for drivers with reduced voltage noise. Clock signals may be provided to semiconductor devices, and may be distributed throughout the device. Drivers are provided along signal paths within the device which may act as buffers for the clock signals. Each clock signal may be coupled to multiple driver circuits within the driver. Each of the multiple driver circuits may be coupled to a different pair of power supply voltage lines. The driver circuits may all have a similar delay to each other.

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Sagamihara, Japan

Kazuyuki Morishige