Nec Corporation

Kazuyuki Mikubo

Sakae Kitajo

Hitoshi Sakamoto

Takeya Hashiguchi

Atsushi Ochi

Mitsuru Yamamoto

Yasuhiro Sasaki

Yuzo Shimada

Naoji Senba

Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus)includes: housingthat forms sealed inner space; circuit unitthat is provided in inner space; first partition platethat is provided in inner spaceand that has upper/lower partition portion, wherein upper/lower partition portionat least partially extends in a lateral direction extending above at least a part of circuit unitand that terminates in front of both lateral sides of housing; and first fanthat is provided through upper/lower partition portion

Electronic apparatus, image display apparatus and method of cooling electronic apparatus

Provided is a highly reliable liquid crystal display device that prevents the penetration of a flying dust and dirt in the outside air. A liquid crystal display device () having a display unit housing case () configured to house a light source unit and a display unit, and an electronic component housing case () configured to house an electronic component. The liquid crystal display device () is tightly closed and externally disposed with heat radiation fins (and).

Dust and dirt resistant liquid crystal display device

A liquid crystal display device includes a sealed housing part, a liquid crystal display part disposed at the front face of the housing part, a light source part housed in the housing part to generate the light to be displayed on the liquid crystal display part, an electric power supply part housed in the housing part to perform electric power supply, a control part housed in the housing part to perform control, and a heat exchange part disposed at the rear face of the housing part to cool the heat generated in the housing part. The heat exchange part includes an air stirring part for stirring the air in the housing part, a forced air cooling part covered with a duct in which the air stirring part is installed and constructed from a plate extending into the housing part, and a natural air cooling part constructed from a plate extending to the outside of the housing part. The forced air cooling part and the natural air cooling part are integrated with a rear face plate of the housing part.

Liquid crystal display device

A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

Cooling device for an electronic equipment

The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unitand the air cooling unitare formed in a unit. A heat absorption surfaceof the liquid cooling unitis contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box. In the liquid cooling unit, a liquid cooling pumpcomposed of an electromagnetic pump is arranged for circulating the coolant in the flow path. The heat generated by the heat generation components such as CPU, heat generator, and the like is thermally diffused with heat conduction into the whole liquid cooling unitby circulating the coolant with the liquid cooling pump

Cooling device for electronic apparatus

A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump&rarr;interposer&rarr;BGA bump&rarr;heat radiating via&rarr;heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.

Semiconductor device packaging structure

A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing through channels which are formed therein. The wiring board of each semiconductor module is provided with sockets having I/O pins and concavities. Electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module. The channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals. The coolant is supplied to the channel grooves from outside and the IC chips are forcedly cooled by the coolant. Therefore, enough cooling capacity is ensured by use of low-profile heat sinks, thereby both high processing speed (due to high packing density and short signal lines between IC chips) and sufficient cooling capacity are attained.

Semiconductor device attaining both high speed processing and sufficient cooling capacity

The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.

Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins

The present invention adopts a circuit pattern in which in a carrier of a package for coupling semiconductor devices at multistage, drawing out lines for selecting individual semiconductor devices are coupled in parallel. Thus, the present invention achieves the multistage coupling semiconductor device which can be completed with a circuit pattern of one kind regardless of the number of stages of a multistage. Using the carrier having the foregoing structure, the semiconductor device is assembled and is subjected to characteristic inspections. Thereafter, the circuit patterns, coupled in parallel, having good electrical characteristics are partially cut by either laser, sand-blast, or etching. The products can be specified according to the circuit pattern which is cut.

Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier

A semiconductor package structure comprising the following elements. A printed board has a first surface on which a plurality of first heat-conductive patterns are provided and a second surface on which a plurality of second heat-conductive patterns are provided. The printed board has heat-conductive through holes connecting the first and second heat-conductive patterns. A multi-chip module has a plurality of semiconductor packages and is provided on the first surface of the printed board. A plurality of heat-conductive supporting members are provided on the first heat-conductive patterns. A heat radiator structure is provided which has at least two heat radiation fins and at least a heat radiation groove defined by the heat radiation fins. The heat radiator structure is provided on the multi-chip module. A plurality of heat conductivity plate-shaped members are fixed to the heat-conductive supporting members and inserted into the heat radiation groove so that the heat conductivity plate-shaped members are in contact with upper surfaces of the heat radiation fins. A first heat transfer route is formed for transferring a heat generated in the multi-chip module through the heat radiator structure to atmosphere surrounding the heat radiator structure. A second heat transfer route is formed for transferring the heat through the heat radiator structure, the heat conductivity plate-shaped members, the heat-conductive supporting members and the first heat-conductive patterns to the printed board and also to the through holes which are heat-conductive to the second heat-conductive patterns. A third heat transfer route is formed for transferring the heat to the printed board.

Growing community of inventors

Tokyo, Japan

Kazuyuki Mikubo