Toray Industries, Inc.

Kazuyuki Matsumura

Toshihisa Nonaka

Koichi Fujimaru

Sho Miyao

Hiroyuki Niwa

Daisuke Kanamori

Yoichi Shimba

Chikara Inagaki

Natsumi Okura

Kanako Sugimoto

An object of the present invention is to enable a scintillator panel of a type having a barrier rib to have sufficient mechanical strength and enhanced brightness. A scintillator panel including a substrate, a barrier rib formed on the substrate, and a scintillator layer having a phosphor and sectioned by the barrier rib, wherein the barrier rib contains one or more compounds (P) selected from the group consisting of polyimides, polyamides, polyamideimides, and polybenzoxazoles.

Scintillator panel and scintillator panel manufacturing method

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same

Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80&#xb0; C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.

Resin composition, resin sheet, and production method for semiconductor device

Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160&#xb0; C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.

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Otsu, Japan

Kazuyuki Matsumura