Kabushiki Kaisha Toshiba

Technology Research Association for Future Additive Manufacturing

Kazuyuki Masukawa

Hiroshi Ohno

Yuji Sasaki

Mitsuo Sasaki

Takashi Obara

Yasunobu Kai

Toshiya Kotani

Kazuya Fukuhara

Chikaaki Kodama

Takaki Hashimoto

Koji Hashimoto

Osamu Yamane

Yuko Kono

Soichi Inoue

Satoshi Tanaka

Kenji Kawano

Kosuke Yanagidaira

Tadashi Iguchi

Shigeki Nojima

Hiromitsu Mashita

Yoshihiro Uozumi

Tetsuo Sakai

Yoshihiro Yanai

Taiga Uno

Seiichi Omoto

Hidefumi Mukai

Satoshi Tsuno

Hirotaka Ichikawa

Motohiro Okada

Shuhei Sota

A machining apparatus that need not exchange a processing nozzle when changing a shaping condition, and increases the use efficiency of a material. The processing nozzle that performs processing by ejecting a processing material towards a molten pool formed on a process surface by an energy line includes a cylindrical inner housing that incorporates a path through which the energy line passes, and ejects the energy line from one end. The processing nozzle also includes a cylindrical outer housing that incorporates the inner housing, and has an inner surface tapered in the ejection direction of the energy line ejected from the inner housing. The processing nozzle also includes a slide mechanism that changes, along the energy line, the relative position of the outer housing with respect to the inner housing.

Processing nozzle, processing head, machining apparatus, and control method and control program of processing nozzle

An optical processing head capable of reducing the energy loss at the time of optical processing is disclosed. The optical processing head includes a first optical element that converts light emitted by a light source into first parallel light, a second optical element that is arranged downstream of the first optical element and converts the first parallel light into first divergent light, a third optical element that is arranged downstream of the second optical element and converts the first divergent light into second parallel light, and a fourth optical element that is arranged downstream of the third optical element and converts the second parallel light into convergent light which is condensed on the processing surface side.

Optical processing head, optical machining apparatus, and control method and control program of optical processing head

An optical processing nozzle that homogeneously supplies a fluid to a processing surface in optical processing. The optical processing nozzle includes a beam path that is arranged so that a beam can pass through the beam path towards a processing surface in order to perform processing using a beam guided from a light source, and a channel structure that is arranged around the beam path and is configured to eject a fluid towards the processing surface. The channel structure includes an inflow port through which the fluid flows, at least two passage holes through which the fluid flowing from the inflow port passes, a channel that guides the fluid from the inflow port to the passage holes, and an ejection port from which the fluid having passed through the at least two passage holes is ejected toward the processing surface.

Optical processing nozzle and optical machining apparatus

An optical processing head capable of downsizing an apparatus while increasing the shaping accuracy of optical processing is disclosed. The optical processing head performs processing while moving, in a predetermined moving direction on a processing surface, an optical spot formed by condensing light emitted by a light source. The optical processing head includes an optical element that condenses light emitted by the light source to generate the optical spot of a shape elongated in the moving direction of the optical spot. Part of the optical spot is set as a processing region, the front side and/or rear side of the processing region in the moving direction is set as a pre-heating region and/or post-heating region, and a processing target object before and/or after processing in the region is heated.

Optical processing head, optical machining apparatus, and optical processing method

An optical processing head that detects a trouble of an optical processing head that will be generated at the time of optical processing before the trouble occurs is disclosed. The optical processing head that performs processing by condensing, on a process surface, a ray emitted by a light source for processing includes a cylindrical housing that surrounds a ray for processing emitted by the light source for processing, a ray emitter for inspection that is incorporated in the cylindrical housing and arranged outside the path of the ray for processing, and a light receiver that is incorporated in the cylindrical housing, arranged outside the path of the ray for processing, and receives a ray for inspection emitted by the ray emitter for inspection. The contamination of the inner surface of the cylindrical housing or the concentration of a scattering object flowing into the cylindrical housing is inspected by using a signal acquired from the light receiver.

Optical processing head, optical processing apparatus, and control method and control program of optical processing apparatus

This specification discloses an optical processing head including a light guide portion that guides, to a process surface, a ray for processing. The light guide portion is further configured to guide, to the process surface, a ray for inspection different in wavelength from the ray for processing. The optical processing head further includes an inspection portion that inspects the state of the process surface based on reflected light of the ray for inspection reflected by the process surface. With the optical processing head, the state of the process surface can be easily inspected even during optical processing.

Optical Processing head, optical processing apparatus, and control method and control program of optical processing apparatus

According to one embodiment, a method for producing a mask layout of an exposure mask for forming wiring of an integrated circuit device, includes estimating shape of the wiring formed based on an edge of a pattern included in an initial layout of the exposure mask. The method includes modifying shape of the edge if the estimated shape of the wiring does not satisfy a requirement.

Integrated circuit device, method for producing mask layout, and program for producing mask layout

According to one embodiment, a production method for a mask layout of an exposure mask includes evaluating a candidate layout by comparison between an imaged image group and a reference image group. The imaged image group is composed of a plurality of imaged images of patterns formed by performing lithography under a plurality of levels of exposure condition using the candidate layout. The reference image group is composed of a plurality of reference images produced by simulation on assumption of a plurality of levels of the exposure condition.

Production method and evaluation apparatus for mask layout

According to one embodiment, an exposure tolerance estimation method is disclosed. The method can include setting a plurality of regions along a first surface of a substrate. The method can form a plurality of patterns for estimation by performing exposure on each of the regions using at least three levels of exposure condition using an exposure mask. The method can measure dimensions of the patterns for estimation and find relationships between the exposure condition and the dimensions. The method can select a first region from the regions. In the first region, a first dimension of a first pattern for estimation formed by exposure using a first exposure condition of an intermediate level out of the at least three levels falls within a previously set range. In addition, the method can calculate an exposure tolerance from a relationship between the first exposure condition and the first dimension.

Exposure tolerance estimation method and method for manufacturing semiconductor device

According to one embodiment, a method for manufacturing a semiconductor device includes forming a stacked body on a substrate. The stacked body includes a plurality of first conductive layers including a metallic element as a main component and a plurality of second conductive layers including a metallic element as a main component provided respectively between the first conductive layers. The method includes making a hole to pierce the stacked body. The method includes making a slit to divide the stacked body. The method includes making a gap between the first conductive layers by removing the second conductive layers by etching via the slit or the hole. The method includes forming a memory film including a charge storage film at a side wall of the hole. The method includes forming a channel body on an inner side of the memory film inside the hole.

Method for manufacturing a semiconductor device including a stacked body comprising pluralities of first and second metallic conductive layers

A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.

Semiconductor device manufacturing method

A mask pattern data creation method includes: determining whether or not a spacing of adjacent assist pattern feature data is not more than a prescribed spacing, based on: initial position data indicating an initially set position of the assist pattern feature data determined based on an illumination condition; and initial size data indicating an initially set size of the assist pattern feature data satisfying a size condition to not optically form an image on the transfer destination; and moving at least one of the adjacent assist pattern feature data or reducing a size of the at least one to increase the spacing of the assist pattern feature data to exceed a prescribed spacing in the case where it is determined that the spacing of the assist pattern feature data is not more than the prescribed spacing.

Mask pattern data creation method and mask

A parameter adjustment method for a plurality of manufacturing devices to form a pattern of a semiconductor device on a substrate using the manufacturing devices includes: adjusting a parameter adjustable for a manufacturing device serving as a reference manufacturing device; obtaining a first shape of a pattern of a semiconductor device to be formed on a substrate; defining an adjustable parameter of another to-be-adjusted manufacturing; obtaining a second shape of the pattern formed on the substrate; calculating a difference amount between a reference finished shape and a to-be-adjusted finished shape; repeatedly calculating the difference amount by changing the to-be-adjusted parameter until the difference amount becomes equal to or less than a predetermined reference value; and outputting as a parameter of the to-be-adjusted manufacturing device the to-be-adjusted parameter.

Parameter adjustment method, semiconductor device manufacturing method, and recording medium

A semiconductor integrated circuit device includes a plurality of contact layers located between two lines running in parallel in a first direction. Each of the contact layers has a structure in which an upper contact and a lower contact are coupled together. The plurality of contact layers are arranged zigzag along the first direction, and coupling portions of the upper contact and the lower contact are displaced from the center of the upper contact in a second direction perpendicular to the first direction.

Growing community of inventors

Yokohama, Japan

Kazuyuki Masukawa