Shinko Electric Industries Co., Ltd.

Nihon Kohden Corporation

Kazuyuki Kubota

Tomoharu Fujii

Yoshihiro Ihara

Norihito Konno

Mitsuhiro Aizawa

Kenichi Mori

Tomoki Kobayashi

A semiconductor apparatus includes an interconnect substrate which includes an antenna module region in which an antenna and a semiconductor integrated circuit electrically connected to the antenna are disposed, and at least one evaluation region situated next to the antenna module region and used to evaluate characteristics of the antenna, wherein the at least one evaluation region has at least one slit formed therein such that the slit includes at least a portion, situated opposite the antenna, of a boundary line that separates the antenna module region and the evaluation region from each other.

Semiconductor apparatus

An electronic device includes: a casing; a through hole which penetrates a bottom plate of the casing; a pin inserted into the through hole; a battery mounted on the pin inside the casing, wherein the battery includes a first lead terminal connected to an upper face of the battery, and a second lead terminal connected to a lower face of the battery; a first wiring layer disposed inside the casing and connected to the first lead terminal; and a second wiring layer disposed inside the casing to overlap with the second lead terminal in planar view. An upper face of the pin is higher in height than an upper face of the second wiring layer. The pin separates the second lead terminal and the second wiring layer from each other such that the second lead terminal and the second wiring layer are electrically insulated from each other.

Electronic device

A patch-type module includes a substrate provided with one surface and another surface that is a sticky surface; an air cell mounted to the substrate; a seal that blocks air from entering the air cell whose first surface is attached to the air cell; an electronic component mounted on the substrate; and a protection sheet that is attached to the sticky surface of the substrate through an adhesion layer, wherein a second surface of the seal is attached to the protection sheet through the adhesion layer, wherein when the protection sheet is peeled, the adhesion layer and the seal are peeled together to expose the sticky surface of the substrate and start introduction of air inside the air cell so that electric power is capable of being power supplied to the electronic component from the air cell.

Patch-type adhesive sensor

A socket has a main body that accommodates a PCBA (Printed Circuit Board Assembly) to be inspected. The PCBA includes a substrate mounted with an electronic component, and terminals protruding from the substrate and having side surfaces exposed at an outer peripheral surface of the substrate, and the terminals are positioned within a cavity or opening of the main body in a state in which the PCBA is accommodated in the cavity or opening. The socket further has probes respectively including a fixed part fixed to the main body, and a movable part movable with respect to the fixed part, and a pressing part to press against the movable part of the probe. The movable part includes a tip end part that moves to a position contactable to the side surface of one terminal within the cavity or opening, when the pressing part presses against the movable part.

Socket

A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells.

Battery and method for producing the same

A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

Circuit board module

A battery built-in board includes a battery component comprising a battery and an insulation part covering the battery, a first insulation layer in which the battery component is placed, and a second insulation layer formed on the first insulation layer and covering the battery component. Rigidity of the insulation part is lower than that of the first insulation layer and the second insulation layer.

Battery built-in board and method for manufacturing the same

A photovoltaic cell mounting substrate includes a substrate; and a plurality of grooves provided at one surface of the photovoltaic cell mounting substrate, the plurality of grooves including a first groove and a second groove that is placed at a circumferential side of the first groove, at the one surface of the substrate, the second groove being formed deeper than the first groove, with respect to the one surface of the substrate.

Photovoltaic cell mounting substrate and photovoltaic cell module

There is provided a semiconductor device. The semiconductor device includes: a first board; a second board joined to the first board; a connection terminal provided between the first board and the second board and electrically connecting the first board and the second board; and an electronic component on at least one of the first board and the second board. The connection terminal serves as an antenna.

Semiconductor device

There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Growing community of inventors

Nagano, Japan

Kazuyuki Kubota